Olivier Joubert

发表

Application of plasma-polymerized methylsilane for 0.18-μm photolithography

Cedric Monget, Carol Y. Lee, Olivier Joubert, 1998, Advanced Lithography.

Process optimization of a negative-tone CVD photoresist for 193-nm lithography applications

Cedric Monget, Olivier Joubert, Timothy W. Weidman, 1999, Advanced Lithography.

Directed self-assembly of PS-b-PDMS into 193nm photoresist patterns and transfer into silicon by plasma etching

Olivier Joubert, Erwine Pargon, Gilles Cunge, 2014, Advanced Lithography.

Characterization of silicon etching in synchronized pulsed plasma

Olivier Joubert, Gilles Cunge, Maxime Darnon, 2013, Advanced Lithography.

Device for resistive memory or logic circuit and method of manufacturing such a device

Bernard Dieny, Olivier Joubert, Maxime Darnon, 2014 .

A CD AFM study of the plasma impact on 193nm photoresist LWR: role of plasma UV and ions

Olivier Joubert, Erwine Pargon, Mickael Martin, 2009, Advanced Lithography.

Dry development of silylated resist: influence of substrate temperature

Olivier Joubert, P. Paniez, Claude Rouyer, 1992, Advanced Lithography.

Role of surface tension in silylation processes

Olivier Joubert, Gilles R. Amblard, André Weill, 1993, Advanced Lithography.

Plasma treatments to improve line-width roughness during gate patterning

Olivier Joubert, Marc Fouchier, Erwine Pargon, 2013 .

Plasma treatment to improve linewidth roughness during gate patterning

Olivier Joubert, Marc Fouchier, Erwine Pargon, 2012, Advanced Lithography.

Study of 193-nm resist degradation under various etch chemistries

Olivier Joubert, Erwine Pargon, Benedicte Mortini, 2007, SPIE Advanced Lithography.

Impact of HBr and Ar cure plasma treatments on 193nm photoresists

Olivier Joubert, Erwine Pargon, Damien Perret, 2008, SPIE Advanced Lithography.

HBr Plasma Treatment Versus VUV Light Treatment to Improve 193 nm Photoresist Pattern Linewidth Roughness

Olivier Joubert, Marc Fouchier, Erwine Pargon, 2011 .

Fluorocarbon high density plasma. V. Influence of aspect ratio on the etch rate of silicon dioxide in an electron cyclotron resonance plasma

Ying Zhang, Olivier Joubert, Gottlieb S. Oehrlein, 1994 .

Uniformity across 200 mm silicon wafers printed by nanoimprint lithography

Olivier Joubert, C. Perret, Cécile Gourgon, 2005 .

Ion flux and ion distribution function measurements in synchronously pulsed inductively coupled plasmas

Olivier Joubert, Gilles Cunge, M. Brihoum, 2013 .

Plasma impact on 193 nm photoresist linewidth roughness: Role of plasma vacuum ultraviolet light

Olivier Joubert, Erwine Pargon, J. Foucher, 2009 .

Etching mechanisms of HfO2, SiO2, and poly-Si substrates in BCl3 plasmas

Olivier Joubert, Erwine Pargon, Gilles Cunge, 2007 .

Characterization of resist-trimming processes by quasi in situ x-ray photoelectron spectroscopy

Olivier Joubert, Erwine Pargon, Songlin Xu, 2004 .

Pulsed transfer etching of PS-PDMS block copolymers self-assembled in 193 nm lithography stacks.

Olivier Joubert, Gilles Cunge, Marc Zelsmann, 2014, ACS applied materials & interfaces.

Influence of pattern density in nanoimprint lithography

Olivier Joubert, C. Perret, Cécile Gourgon, 2003 .

Ion flux composition in HBr/Cl2/O2 and HBr/Cl2/O2/CF4 chemistries during silicon etching in industrial high-density plasmas

Olivier Joubert, R. L. Inglebert, Gilles Cunge, 2002 .

Fluorocarbon high‐density plasmas. II. Silicon dioxide and silicon etching using CF4 and CHF3

Olivier Joubert, Gottlieb S. Oehrlein, David Vender, 1994 .

Reducing damage to Si substrates during gate etching processes by synchronous plasma pulsing

Olivier Joubert, Erwine Pargon, Gilles Cunge, 2010 .

Dielectric Trenches Patterning: Metallic Vs Organic Hard Mask

Olivier Joubert, Maxime Darnon, Thibaut David, 2007 .

Revisiting the mechanisms involved in Line Width Roughness smoothing of 193 nm photoresist patterns during HBr plasma treatment

Olivier Joubert, Erwine Pargon, Gilles Cunge, 2013 .

Line edge roughness characterization with a three-dimensional atomic force microscope: Transfer during gate patterning processes

Olivier Joubert, J. Foucher, S. Pauliac, 2005 .

Unbiased line width roughness measurements with critical dimension scanning electron microscopy and critical dimension atomic force microscopy

Olivier Joubert, Marc Fouchier, Erwine Pargon, 2012 .

Benefits of plasma treatments on critical dimension control and line width roughness transfer during gate patterning

Olivier Joubert, Marc Fouchier, Erwine Pargon, 2013 .

Mechanisms involved in HBr and Ar cure plasma treatments applied to 193 nm photoresists

A. Bazin, Olivier Joubert, E. Pargon, 2009 .

Anisotropic etching of polymers in SO2/O2 plasmas: Hypotheses on surface mechanisms

Olivier Joubert, Michel Pons, J. Pelletier, 1994 .

Metal-Insulator-Metal capacitors using Y2O3 dielectric grown by pulsed-injection plasma enhanced metalorganic chemical vapor deposition

Catherine Dubourdieu, Serge Blonkowski, Olivier Joubert, 2004 .

The Cutting Edge of Plasma Etching

Olivier Joubert, Thorsten Lill, O. Joubert, 2008, Science.

X-ray photoelectron spectroscopy investigation of sidewall passivation films formed during gate etch processes

Olivier Joubert, L. Desvoivres, Laurent Vallier, 2001 .

Comparison of Dry Development Techniques using O2 and SO2/O2 Low-Pressure Plasmas

Olivier Joubert, Michel Pons, Andre Weill, 1994 .

Undulation of sub-100nm porous dielectric structures: A mechanical analysis

Sylvain Maitrejean, Olivier Joubert, Jean-Charles Barbe, 2007 .

XPS analysis with an ultra clean vacuum substrate carrier for oxidation and airborne molecular contamination prevention

Olivier Joubert, V. Loup, E. Veran, 2008 .

High density plasma etching of low k dielectric polymers in oxygen-based chemistries

Marceline Bonvalot, Olivier Joubert, David Fuard, 2001 .

Sidewall passivation layer thickness and composition profiles of etched silicon patterns from angle resolved x-ray photoelectron spectroscopy analysis

Olivier Joubert, Maxime Darnon, M. Haass, 2012 .

Linewidth roughness transfer measured by critical dimension atomic force microscopy during plasma patterning of polysilicon gate transistors

Olivier Joubert, Erwine Pargon, J. Foucher, 2008 .