M. Hatano

Mechanism of moisture uptake induced via failure and its impact on 45nm node interconnect design

T. Fujimaki, K. Higashi, N. Nakamura, 2005, IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..

"Sea of Kelvin" multiple-pattern arrangement interconnect characterization for low-k/Cu dual damascene and its findings

M. Hatano, H. Kaneko, K. Yoshida, 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).

EM lifetime improvement of Cu damascene interconnects by p-SiC cap layer

M. Hatano, Hisashi Kaneko, Y. Shimooka, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).