F. Liu

RF-microwave multi-band design solutions for multilayer organic system on package integrated passives

M. Tentzeris, V. Sundaram, M. Maeng, 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).

System-on-a-package (SOP) module development for a digital, RF and optical mixed signal integrated system

M. Tentzeris, V. Sundaram, D. Guidotti, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).