David Kohen

PPAC scaling enablement for 5nm mobile SoC technology

John Zhu, Naoto Horiguchi, Suman Datta, 2017, 2017 47th European Solid-State Device Research Conference (ESSDERC).

Recess-type waveguide integrated germanium on silicon avalanche photodiode

Ansheng Liu, Yann Malinge, David Kohen, 2021, 2021 Optical Fiber Communications Conference and Exhibition (OFC).

Integration of GaAs, GaN, and Si-CMOS on a common 200 mm Si substrate through multilayer transfer process

Chuan Seng Tan, Eugene A. Fitzgerald, Li Zhang, 2016 .

Monolithic integration of III–V HEMT and Si-CMOS through TSV-less 3D wafer stacking

Chuan Seng Tan, David Kohen, Shuyu Bao, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Electrical Properties of III-V/Oxide Interfaces

Marc Heyns, Marc Meuris, Guy Brammertz, 2009 .

The role of AsH3 partial pressure on anti-phase boundary in GaAs-on-Ge grown by MOCVD – Application to a 200 mm GaAs virtual substrate

Soon Fatt Yoon, Chuan Seng Tan, Eugene A. Fitzgerald, 2015 .

Direct MOCVD epitaxy of GaAsP on SiGe virtual substrate without growth of SiGe

Soon Fatt Yoon, Bing Wang, Jurgen Michel, 2016 .