N. P. Pham

Through-wafer copper electroplating for three-dimensional interconnects

G. Craciun, N. T. Nguyen, E. Boellaard, 2002 .

Direct spray coating of photoresist for MEMS applications

Pasqualina M. Sarro, Joachim N. Burghartz, Tom L. M. Scholtes, 2001, SPIE MOEMS-MEMS.

A micromachining post-process module for RF silicon technology

Pasqualina M. Sarro, Joachim N. Burghartz, M. Bartek, 2000, International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).

IC-compatible two-level bulk micromachining process module for RF silicon technology

Pasqualina M. Sarro, Joachim N. Burghartz, N. P. Pham, 2001 .

Substrate options and add-on process modules for monolithic RF silicon technology

Pasqualina M. Sarro, Joachim N. Burghartz, M. Bartek, 2002, Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting.

IC-compatible process for pattern transfer in deep wells for integration of RF components

Pasqualina M. Sarro, Joachim N. Burghartz, N. P. Pham, 2000 .

A sub-surface metallization post-process IC module for RF technology

Pasqualina M. Sarro, Joachim N. Burghartz, Behzad Rejaei, 2000, Proceedings of the 2000 BIPOLAR/BiCMOS Circuits and Technology Meeting (Cat. No.00CH37124).