E. Martincic
发表
E. Lefeuvre,
S. Duque Tisnes,
Z. Shi,
2020,
2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP).
E. Martincic,
J. Montserrat,
J. R. Morante,
2007,
SPIE Microtechnologies.
Fabrication and characterization of flexible pressure sensor arrays made by film transfer technology
E. Martincic,
T. H. N. Dinh,
P-Y Joubert,
2013,
2013 IEEE SENSORS.
E. Martincic,
R. Vives Fos,
V. Aucejo Galindo,
1998
.
E. Martincic,
E. Dufour-Gergam,
M. Woytasik,
2010,
2010 IEEE 16th International Mixed-Signals, Sensors and Systems Test Workshop (IMS3TW).
E. Martincic,
A. Uranga,
P. Nouet,
2009,
IEEE Sensors Journal.
V. Mathet,
E. Martincic,
S. Megherbi,
2006
.
E. Martincic,
Y. Le Bihan,
M. Woytasik,
2007,
TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference.
E. Martincic,
L. Darrasse,
M. Woytasik,
2012,
2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.
E. Martincic,
M. Woytasik,
E. Lefeuvre,
2013,
IEEE Sensors Journal.
E. Martincic,
T. H. N. Dinh,
E. Dufour-Gergam,
2014,
2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).
E. Martincic,
Philippe Boucaud,
Guy Fishman,
2010
.
E. Martincic,
B. Belier,
M. Woytasik,
2012,
2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.
H. Mathias,
E. Martincic,
O. Legendre,
2010,
2010 IEEE Sensors.