Ying-Ta Chiu

Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization

Yi-Shao Lai, Ying-Ta Chiu, Chiu-Wen Lee, 2009 .

Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints

Yi-Shao Lai, Ying-Ta Chiu, Jenn-Ming Song, 2012, Microelectron. Reliab..

Electromigration reliability of redistribution lines in wafer-level chip-scale packages

Yi-Shao Lai, Chin-Li Kao, Ying-Ta Chiu, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Alloying modification of Sn-Ag-Cu solders by manganese and titanium

Li-Wei Lin, Yi-Shao Lai, Ying-Ta Chiu, 2009, Microelectron. Reliab..

Contaminant failure analysis: A particle library and its search engine

Ying-Ta Chiu, Ping-Feng Yang, Mei-Ju Lu, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Yi-Shao Lai, Chin-Li Kao, Ying-Ta Chiu, 2007, Microelectron. Reliab..

The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad

Yi-Shao Lai, Ying-Ta Chiu, Kuo-Chang Lu, 2013 .

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

Yi-Shao Lai, Ying-Ta Chiu, Jenn-Ming Song, 2008 .

Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections

Yi-Shao Lai, Ying-Ta Chiu, Jenn-Ming Song, 2008 .

Electromigration reliability of redistribution lines in wafer-level chip-scale packages

Yi-Shao Lai, Chin-Li Kao, Ying-Ta Chiu, 2011, ECTC 2011.