Chiu-Wen Lee

Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization

Yi-Shao Lai, Ying-Ta Chiu, Chiu-Wen Lee, 2009 .

Effect of Test Conditions on Electromigration Reliability of Sn–Ag–Cu Flip-Chip Solder Interconnects

Yi-Shao Lai, Chiu-Wen Lee, Chin-Li Kao, 2007 .

Electromigration Reliability and Morphologies of 62Sn–36Pb–2Ni and 62Sn–36Pb–2Cu Flip-Chip Solder Joints

Yi-Shao Lai, Chiu-Wen Lee, Y. Lai, 2007, IEEE Transactions on Components and Packaging Technologies.

Novel ultra-fine line 2.1D package with organic interposer

Chiu-Wen Lee, Wei-Chung Chen, Min-Hua Chung, 2017, 2017 IEEE CPMT Symposium Japan (ICSJ).

Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based Process

Chen-Chao Wang, Chiu-Wen Lee, Hung-Chun Kuo, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Yi-Shao Lai, Chin-Li Kao, Ying-Ta Chiu, 2007, Microelectron. Reliab..