Toshiaki Itabashi

TSV/3D-TSV Package materilals solutilon from DuPontElectronilc Technolog'ies

Toshiaki Itabashi, 2008 .

High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing

Hiroyuki Ishida, Masashi Kotani, T. Fischer, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

High temperature resistant bonding solutions enabling thin wafer processing (Characterization of polyimide base temporary bonding adhesive for thinned wafer handling)

Toshiaki Itabashi, Melvin P. Zussman, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).