Stefano Piersanti

发表

Impact of Genetic Algorithm Control Parameters on Chip PDN Decoupling Capacitors Placement

Antonio Orlandi, Stefano Piersanti, 2018, IEEE Transactions on Electromagnetic Compatibility.

Firms Default Prediction with Machine Learning

Stefano Piersanti, Tesi Aliaj, Aris Anagnostopoulos, 2019, MIDAS@PKDD.

Modeling optimization of test patterns used in de-embedding method for through silicon via (TSV) measurement in silicon interposer

Jun Fan, Chulsoon Hwang, Qian Wang, 2016, 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Electromagnetic Absorbing Materials Design by Optimization Using a Machine Learning Approach

Antonio Orlandi, Francesco de Paulis, Stefano Piersanti, 2018 .

Through-Silicon Via Capacitance–Voltage Hysteresis Modeling for 2.5-D and 3-D IC

Joungho Kim, Antonio Orlandi, Dong-Hyun Kim, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

PDN Tool: Ananalytical Model to Calculate the Input Impedance of Chip and Silicon Interposer Power Distribution Network

Antonio Orlandi, Stefano Piersanti, Riccardo Cecchetti, 2018 .

Defects Identification in a TSV Daisy-Chain Structure by a Machine Learning Approach

Antonio Orlandi, Stefano Piersanti, S. Piersanti, 2018, IEEE Transactions on Electromagnetic Compatibility.

Millimeter waves channel measurements and path loss models

Dajana Cassioli, Stefano Piersanti, Luca Alfredo Annoni, 2012, 2012 IEEE International Conference on Communications (ICC).

TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization

Jun Fan, Qian Wang, Antonio Orlandi, 2017, IEEE Transactions on Instrumentation and Measurement.

Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis

Jun Fan, Antonio Orlandi, Dong-Hyun Kim, 2017, IEEE Transactions on Electromagnetic Compatibility.

Near-Field Shielding Performances of Absorbing Materials for Integrated Circuits (IC) Applications. Part II: Crossing Excitation

Antonio Orlandi, James L. Drewniak, Bruce Archambeault, 2018, IEEE Transactions on Electromagnetic Compatibility.

Genetic Algorithm Optimization for the Total Radiated Power of a Meandered Line by Using an Artificial Neural Network

Antonio Orlandi, Stefano Piersanti, S. Piersanti, 2017, IEEE Transactions on Electromagnetic Compatibility.

Nonlinear Modeling of Ferromagnetic Cores for Circuit Applications

Antonio Orlandi, Stefano Piersanti, Enza Pellegrino, 2015 .

Impact of chip and interposer PDN to eye diagram in high speed channels

Jun Fan, Antonio Orlandi, Stefano Piersanti, 2018, 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI).

Analytical evaluation of scattering parameters for equivalent circuit of through silicon via array

Jun Fan, Antonio Orlandi, Stefano Piersanti, 2015 .

Characterization of path loss and delay spread of 60-GHz UWB channels vs. frequency

Dajana Cassioli, Stefano Piersanti, Luca Alfredo Annoni, 2013, 2013 IEEE International Conference on Communications (ICC).

Efficient Iterative Process based on an Improved Genetic Algorithm for Decoupling Capacitor Placement at Board Level

Antonio Orlandi, Francesco de Paulis, Stefano Piersanti, 2019 .

Electric Dipole Equations in Very Near Field Conditions for Electromagnetic Shielding Assessment. Part I: Radiation Equations

Antonio Orlandi, James L. Drewniak, Bruce Archambeault, 2017, IEEE Transactions on Electromagnetic Compatibility.

Decoupling Capacitors Placement at Board Level Adopting a Nature-Inspired Algorithm

Antonio Orlandi, Francesco de Paulis, Stefano Piersanti, 2019, Electronics.

Decoupling Capacitors Placement for a Multichip PDN by a Nature-Inspired Algorithm

Antonio Orlandi, Stefano Piersanti, Francesco de Paulis, 2018, IEEE Transactions on Electromagnetic Compatibility.

Impact of Frequency-Dependent and Nonlinear Parameters on Transient Analysis of Through Silicon Vias Equivalent Circuit

Antonio Orlandi, Stefano Piersanti, Francesco de Paulis, 2015, IEEE Transactions on Electromagnetic Compatibility.

Novel De-Embedding Methodology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer

Chulsoon Hwang, Qian Wang, Antonio Orlandi, 2017, IEEE Transactions on Electromagnetic Compatibility.

Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias

Joungho Kim, Antonio Orlandi, Stefano Piersanti, 2015, IEEE Transactions on Electromagnetic Compatibility.

Electric Dipole Equations in Very-Near-Field Conditions for Electromagnetic Shielding Assessment—Part II: Wave Impedance, Reflection, and Transmission

Antonio Orlandi, James L. Drewniak, Bruce Archambeault, 2017, IEEE Transactions on Electromagnetic Compatibility.

Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures

Joungho Kim, Antonio Orlandi, Daniel H. Jung, 2017, IEEE Transactions on Electromagnetic Compatibility.

Near-Field Shielding Performances of EMI Noise Suppression Absorbers

Antonio Orlandi, James L. Drewniak, Bruce Archambeault, 2017, IEEE Transactions on Electromagnetic Compatibility.

Near Field Shielding Performances of Absorbing Materials for Integrated Circuits (IC) Applications Part I: Lateral Excitation

Antonio Orlandi, James L. Drewniak, Bruce Archambeault, 2018, IEEE Transactions on Electromagnetic Compatibility.