T. Braun
发表
T. Braun,
M. Schneider-Ramelow,
K.-D. Lang,
2019,
2019 IEEE CPMT Symposium Japan (ICSJ).
H. Reichl,
R. Aschenbrenner,
T. Braun,
2007,
2007 8th International Conference on Electronic Packaging Technology.
T. Braun,
K.-F. Becker,
Rolf Aschenbrenner,
2014
.
R. Aschenbrenner,
T. Braun,
R. Jordan,
2013,
2013 10th China International Forum on Solid State Lighting (ChinaSSL).
R. Aschenbrenner,
T. Braun,
M. Töpper,
2018,
2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM).
H. Reichl,
R. Aschenbrenner,
T. Braun,
2004,
4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004..
R. Aschenbrenner,
T. Braun,
J. Bauer,
2016,
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
H. Reichl,
T. Braun,
K.-F. Becker,
2009,
2009 59th Electronic Components and Technology Conference.
R. Aschenbrenner,
T. Braun,
K.-F. Becker,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
R. Aschenbrenner,
T. Braun,
J. Bauer,
2014,
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
T. Braun,
K.-D. Lang,
K.-F. Becker,
2019,
2019 International Wafer Level Packaging Conference (IWLPC).
Andreas Ostmann,
J. Bauer,
R. Aschenbrenner,
2011
.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2004,
IEEE Transactions on Advanced Packaging.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2003
.
M. Kaynak,
M. Wietstruck,
C. Wipf,
2017,
2017 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM).
T. Braun,
S. Voges,
R. Aschenbrenner,
2015,
2015 European Conference on Circuit Theory and Design (ECCTD).
M. Kaynak,
M. Wietstruck,
R. Aschenbrenner,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
J. Bauer,
R. Aschenbrenner,
T. Braun,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
J. Bauer,
R. Aschenbrenner,
T. Braun,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
H. Reichl,
R. Aschenbrenner,
T. Braun,
2006,
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
H. Reichl,
T. Braun,
M. Schneider-Ramelow,
2007,
2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).
J. Bauer,
R. Aschenbrenner,
T. Braun,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
R. Aschenbrenner,
T. Braun,
M. Topper,
2016,
2016 IEEE 16th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF).
R. Aschenbrenner,
T. Braun,
M. Topper,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
H. Reichl,
F. Solzbacher,
T. Braun,
2006,
56th Electronic Components and Technology Conference 2006.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2005,
IEEE Transactions on Electronics Packaging Manufacturing.
T. Braun,
K.-F. Becker,
E. Graf,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
H. Reichl,
T. Braun,
B. Wunderle,
2008
.
R. Aschenbrenner,
T. Braun,
K.-F. Becker,
2018,
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Microtechnology For Realization Of Dielectrophoresis Enhanced Microwells For Biomedical Applications
R. Guerrieri,
H. Reichl,
J. Bauer,
2007,
2007 9th Electronics Packaging Technology Conference.
T. Braun,
O. Ehrmann,
K. Zoschke,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
J. Bauer,
T. Braun,
K.-F. Becker,
2014
.
J. Bauer,
R. Aschenbrenner,
T. Braun,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
H. Reichl,
R. Aschenbrenner,
T. Braun,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
H. Reichl,
T. Braun,
B. Wunderle,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.