K.-F. Becker
发表
T. Braun,
M. Schneider-Ramelow,
K.-D. Lang,
2019,
2019 IEEE CPMT Symposium Japan (ICSJ).
H. Reichl,
R. Aschenbrenner,
T. Braun,
2007,
2007 8th International Conference on Electronic Packaging Technology.
C. P. Wong,
H. Reichl,
Jianmin Qu,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
T. Braun,
K.-F. Becker,
Rolf Aschenbrenner,
2014
.
R. Aschenbrenner,
K.-F. Becker,
H. Reichl,
1997,
Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).
H. Reichl,
T. Braun,
K.-F. Becker,
2009,
2009 59th Electronic Components and Technology Conference.
Frank Ansorge,
H. Reichl,
Bernd Michel,
2001
.
Herbert Reichl,
K.-F. Becker,
M. Koch,
2005,
Microelectron. Reliab..
R. Aschenbrenner,
T. Braun,
K.-F. Becker,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
K.-F. Becker,
M. Schneider,
L. Bottcher,
2008,
2008 European Microwave Integrated Circuit Conference.
H. Reichl,
R. Aschenbrenner,
K.-F. Becker,
2007,
2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium.
J. Bauer,
K.-F. Becker,
Rolf Aschenbrenner,
2011
.
W. John,
H. Reichl,
K.-F. Becker,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
Frank Ansorge,
Herbert Reichl,
K.-F. Becker,
1999
.
T. Braun,
K.-D. Lang,
K.-F. Becker,
2019,
2019 International Wafer Level Packaging Conference (IWLPC).
Andreas Ostmann,
J. Bauer,
R. Aschenbrenner,
2011
.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2004,
IEEE Transactions on Advanced Packaging.
Herbert Reichl,
K.-F. Becker,
M. Koch,
2006,
Microelectron. Reliab..
K.-F. Becker,
H. Mokrani,
K.-D. Lang,
2004
.
K.-F. Becker,
S. Voges,
Christian Zech,
2015
.
Frank Ansorge,
Herbert Reichl,
R. Aschenbrenner,
1998,
Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204).
R. Aschenbrenner,
K.-F. Becker,
O. Hoelck,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
M. Kaynak,
M. Wietstruck,
R. Aschenbrenner,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
H. Reichl,
R. Aschenbrenner,
T. Braun,
2006,
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
H. Reichl,
T. Braun,
M. Schneider-Ramelow,
2007,
2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).
Herbert Reichl,
K.-F. Becker,
Rolf Aschenbrenner,
2002,
2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).
Herbert Reichl,
K.-F. Becker,
Rolf Aschenbrenner,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
H. Reichl,
F. Solzbacher,
T. Braun,
2006,
56th Electronic Components and Technology Conference 2006.
H. Reichl,
R. Aschenbrenner,
T. Braun,
2005,
IEEE Transactions on Electronics Packaging Manufacturing.
H. Reichl,
M. Schneider-Ramelow,
K.-F. Becker,
2009
.
T. Braun,
K.-F. Becker,
E. Graf,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
H. Reichl,
K.-F. Becker,
B. Wunderle,
2010,
3rd Electronics System Integration Technology Conference ESTC.
H. Reichl,
K.-F. Becker,
B. Wunderle,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
R. Aschenbrenner,
T. Braun,
K.-F. Becker,
2018,
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Herbert Reichl,
K.-F. Becker,
U. Oestermann,
2002,
4th Electronics Packaging Technology Conference, 2002..
Microtechnology For Realization Of Dielectrophoresis Enhanced Microwells For Biomedical Applications
R. Guerrieri,
H. Reichl,
J. Bauer,
2007,
2007 9th Electronics Packaging Technology Conference.
J. Bauer,
T. Braun,
K.-F. Becker,
2014
.
J. Bauer,
R. Aschenbrenner,
T. Braun,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
H. Reichl,
R. Aschenbrenner,
T. Braun,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..