Changqing Liu

发表

Numerical analysis of focal depth for continuous phase filters

Zhili Zhang, Hongcai Li, Yinpeng Wei, 2017, Applied Optics and Photonics China.

Control of the focal depth by annular phase-only pupil filters

Zhili Zhang, Yinpeng Wei, Xiaofeng Zhao, 2017, Applied Optics and Photonics China.

Research on spectral clustering infrared image segmentation algorithm based on improved sparse matrix

Wei Cai, Yinpeng Wei, Xiaofeng Zhao, 2018, International Conference on Digital Image Processing.

Poly(4-vinylaniline)/polyaniline bilayer functionalized bacterial cellulose for flexible electrochemical biosensors.

Guang Yang, Changqing Liu, Changqing Liu, 2019, Langmuir : the ACS journal of surfaces and colloids.

Piezoresistance and electrical resistivity of Pd, Au, and Cu films

Changqing Liu, Changqing Liu, Shien-Uang Jen, 2003 .

Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate

Paul Conway, Vadim V. Silberschmidt, Jicheng Gong, 2008 .

Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activation

Paul Conway, David A. Hutt, David C. Whalley, 2002 .

Fracture Behaviour of Bacterial Cellulose Hydrogel: Microstructural Effect

Zhijun Shi, Guang Yang, Vadim V. Silberschmidt, 2016 .

Electrodeposition and characterisation of Sn–Ag–Cu solder alloys for flip-chip interconnection

Geoffrey D. Wilcox, Yi Qin, Changqing Liu, 2010 .

Effect of ultrasonic energy on nanoscale interfacial structure in copper wire bonding on aluminium pads

Vadim V. Silberschmidt, Zhong Chen, Hui Xu, 2011 .

Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects

Paul Conway, Dezhi Li, Changqing Liu, 2005 .

Kinetic Monte Carlo simulation of kinetically limited copper electrocrystallization on an atomically even surface

Paul Conway, Jun Liu, Changqing Liu, 2009 .

Modelling of Ag3Sn coarsening and its effect on creep of Sn-Ag eutectics

Paul Conway, Vadim V. Silberschmidt, Jicheng Gong, 2006 .

Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads

Vadim V. Silberschmidt, Zhong Chen, Jun Wei, 2010 .

The role of bonding duration in wire bond formation: a study of footprints of thermosonic gold wire on aluminium pad

Vadim V. Silberschmidt, Zhong Chen, Jun Wei, 2010 .

Electrodeposition of indium for bump bonding

Changqing Liu, B. Stevens, D. Hutt, 2008, 2008 58th Electronic Components and Technology Conference.

Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation

Paul Conway, David A. Hutt, David C. Whalley, 2002 .

Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders

David A. Hutt, David C. Whalley, Michael Clode, 2007 .

Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds

Vadim V. Silberschmidt, Zhong Chen, Timothy J. White, 2011 .

Intermetallic phase transformations in Au–Al wire bonds

Vadim V. Silberschmidt, Zhong Chen, Timothy J. White, 2011 .

ASSESSMENT OF ADHESION OF TI(Y)N AND TI(LA)N COATINGS BY AN IN SITU SEM CONSTANT-RATE TENSILE TEST

Zhiming Yu, Changqing Liu, Changqing Liu, 1994 .

30-GHz High-Frequency Application of Screen Printed Interconnects on an Organic Substrate

Masahiro Aoyagi, Ying Ying Lim, Manabu Yoshida, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder

Fengshun Wu, Changqing Liu, Weisheng Xia, 2015 .

Oxidation protection of copper surfaces using self-assembled monolayers of octadecanethiol

David A. Hutt, Changqing Liu, D. Hutt, 2005 .

Microstructural and mechanical integrity of Cu/Cu interconnects formed by self-propagating exothermic reaction methods

Fengshun Wu, Eric Hou, Changqing Liu, 2014 .

Inter-dependence of processing and alloy composition on the reliability of Sn-based lead free solders in fine pitch FCOB interconnection

Paul Conway, Rachel C. Thomson, Zhiheng Huang, 2003, IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003..

Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate

Paul Conway, Vadim V. Silberschmidt, Jicheng Gong, 2009 .

Electroless nickel bumping of aluminum bondpads. II. Electroless nickel plating

Paul Conway, David A. Hutt, David C. Whalley, 2002 .

Reliability testing of electronic packages in harsh environments

Maria Mirgkizoudi, Steve Riches, Changqing Liu, 2010, 2010 12th Electronics Packaging Technology Conference.

Tribological and electrochemical performance of PVD TiN coatings on the femoral head of Ti–6Al–4V artificial hip joints

Changqing Liu, Changqing Liu, A. Matthews, 2003 .

Effect of thermal aging on interfacial behaviour of copper ball bonds

Hui Xu, Changqing Liu, V. Silberschmidt, 2008, 2008 2nd Electronics System-Integration Technology Conference.

A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

Vadim V. Silberschmidt, Zhong Chen, Timothy J. White, 2009 .

Surface treatments for inkjet printing onto a PTFE-based substrate for high frequency applications

Ying Ying Lim, Changqing Liu, Yee Mey Goh, 2013 .

Effects of process parameters on bondability in thermosonic copper ball bonding

Hui Xu, Changqing Liu, V.V. Silberschmidt, 2008, 2008 58th Electronic Components and Technology Conference.

Facilitating intermetallic formation in wire bonding by applying a pre-ultrasonic energy

Vadim V. Silberschmidt, Zhong Chen, Hui Xu, 2011 .

Mesomechanical modelling of SnAgCu solder joints in flip chip

Paul Conway, Vadim V. Silberschmidt, Jicheng Gong, 2008 .