E. Davitt

Reliability testing of SnAgCu solder surface mount assembly

Frank Stam, E. Davitt, J. Barrett, 1999 .

Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints

E. Davitt, F. A. Stam, F. Stam, 2001, Microelectron. Reliab..