Hsiang-Yao Hsiao

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

Chih Chen, K. N. Tu, Hsiang-Yao Hsiao, 2013, Microelectron. Reliab..

Thermomigration in Pb-free SnAg solder joint under alternating current stressing

Hsiang-Yao Hsiao, Chih Chen, H. Hsiao, 2009 .

Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy

Da-Jeng Yao, Hsiang-Yao Hsiao, S. W. Liang, 2008 .

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

Han-wen Lin, King-Ning Tu, Hsiang-Yao Hsiao, 2012, Science.

The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering

King-Ning Tu, Hsiang-Yao Hsiao, K. Tu, 2012 .

Thermomigration in flip-chip SnPb solder joints under alternating current stressing

Hsiang-Yao Hsiao, Chih Chen, H. Hsiao, 2007 .