Jerry J. Broz

The leading edge of production wafer probe test technology

William R. Mann, Frederick L. Taber, Philip W. Seitzer, 2004, 2004 International Conferce on Test.

Reducing device yield fallout at wafer level test with electrohydrodynamic (EHD) cleaning

Jerry J. Broz, James C. Andersen, Reynaldo M. Rincon, 2000, Proceedings International Test Conference 2000 (IEEE Cat. No.00CH37159).

Probe contact resistance variations during elevated temperature wafer test

Jerry J. Broz, Reynaldo M. Rincon, 1999, International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034).

Effect of Aggregate and Specimen Size on Fracture Properties of Dam Concrete

Victor E. Saouma, Jerry J. Broz, J. Broz, 1991 .