Brenda Bai

High throughput non-contact SiP testing

Lin Fu, Igor M. Filanovsky, Philippe Cauvet, 2007, 2007 IEEE International Test Conference.

Noncontact wafer probe using wireless probe cards

Lin Fu, Igor M. Filanovsky, Krzysztof Iniewski, 2005, IEEE International Conference on Test, 2005..

Non-contact Testing for SoC and RCP (SIPs) at Advanced Nodes

Igor M. Filanovsky, Md. Mahbub Reja, Brian Moore, 2008, 2008 IEEE International Test Conference.

A CMOS voltage reference using compensation of mobility and threshold voltage temperature effects

Brian Moore, Brenda Bai, I.M. Filanovsky, 2009, 2009 52nd IEEE International Midwest Symposium on Circuits and Systems.