Kuniaki Takahashi

Mechanical fatigue test method for chip/underfill delamination in flip-chip packages

Hideo Aoki, Kenji Hirohata, Takashi Kawakami, 2002 .

Packaging Technology and Evaluation of Test Method Regarding BGA·CSP for Notebook PCs

Hideki Ogawa, Kuniaki Takahashi, 1998 .

The Future Trend and Requests from Advanced Electronic Products to Packaging Technologies

Kuniaki Takahashi, 2000 .

Packaging and process technology for personal computers

Kuniaki Takahashi, sadao Makita, 1996 .

Experimental and Numerical Verification of Fatigue Life Estimation for Solder Bumps

Hiroyuki Takahashi, Takashi Kawakami, Toshikazu Shibuya, 2001 .

Stochastic structural reliability design for electronics packages using response surface methodology and Bayes' theory

Qiang Yu, Kenji Hirohata, Masaki Shiratori, 2001 .

W05-(3) Road Maps on System Integration and Packaging Technologies for Semiconductor Devices

Takashi Kawakami, Kuniaki Takahashi, 2001 .

Hyperspectral imaging of pathology samples

Jeremy M. Lerner, Hiromichi Tsurui, Sachiko Hirose, 1999, Photonics West - Biomedical Optics.

704 A Crack Detection Method Based on Natural Frequency Change (2^ Report)

Tadashi Horibe, Kuniaki Takahashi, Kiyoshi Ohmori, 2008 .