V. Glaw

Technology Requirements for Chip-On-Chip Packaging Solutions

H. Reichl, O. Ehrmann, M. Topper, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Wafer level package using double balls

Herbert Reichl, Oswin Ehrmann, P. Coskina, 2000, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507).

High power multichip modules employing the planar embedding technique and microchannel water heat sinks

Herbert Reichl, Oswin Ehrmann, M. Topper, 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

Comparison of nano particle implantation with picosecond lasers by concerning different wavelengths from Aluminum and Copper on silicon wafer substrate

K.-D. Lang, H. J. Eichler, V. Glaw, 2017, 2017 Conference on Lasers and Electro-Optics (CLEO).

Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces

H. Reichl, F. Solzbacher, T. Braun, 2006, 56th Electronic Components and Technology Conference 2006.

Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging

H. Reichl, O. Ehrmann, M. Topper, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules

T. Braun, O. Ehrmann, K. Zoschke, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Deposition of Al and Cu nanoparticles on silicon wafer using a picosecond Nd:YAG laser: An experiment-based parameter optimization guide

K.-D. Lang, H. J. Eichler, V. Glaw, 2017, 2017 Conference on Lasers and Electro-Optics (CLEO).

Embedding technology-a chip-first approach using BCB

Herbert Reichl, Oswin Ehrmann, M. Topper, 1997, Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces.

Packaging of radiation and particle detectors

H. Reichl, O. Ehrmann, M. Topper, 2006, 56th Electronic Components and Technology Conference 2006.