Melida Chin

Reliability evaluation methodology for chip-package interaction - die corner edge failure mechanism

Melida Chin, Amit Marathe, 2010, 2010 IEEE International Reliability Physics Symposium.

Product Oriented Sensitivity Analysis for Multi-Station Compliant Assemblies

Melida Chin, Jaime A. Camelio, Jianpeng Yue, 2006 .

Product-Oriented Sensitivity Analysis for Multistation Compliant Assemblies

Melida Chin, Jaime A. Camelio, Jianpeng Yue, 2007 .