Elke Zakel

A Low Cost Bumping Process For Flip Chip-technology Using Electroless Nickel Bumping And Solder Ball Placement

Herbert Reichl, Paul Kasulke, Andreas Ostmannm, 1997, IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference].

Gehäusung chip and method of manufacturing a chip Gehäusung

Herbert Reichl, Elke Zakel, Ghassem Azdasht, 1995 .

A process for producing a contactless smart card and contactless smart card

Frank Ansorge, Paul Kasulke, Elke Zakel, 1996 .