D. W. Peterson

Design and Analysis of the Channel Waveguide Transformer

Peter H. Siegel, Anthony R. Kerr, D. W. Peterson, 1983 .

Short and long loop manufacturing feedback using a multisensor assembly test chip

J. N. Sweet, D. W. Peterson, M. R. Tuck, 1990 .

Calculation and validation of thermomechanical stresses in flip chip BGA using the ATC4.2 test vehicle

J. N. Sweet, S. N. Burchett, D. W. Peterson, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Liquid encapsulant stress variations as measured with the ATCO4 assembly test chip

J. N. Sweet, D. W. Peterson, J. A. Emerson, 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method

J. N. Sweet, S. N. Burchett, A. H. Hsia, 1997 .

Liquid encapsulant and uniaxial calibration mechanical stress measurement with the ATC04 assembly test chip

J. N. Sweet, D. W. Peterson, J. Sweet, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

Evaluating plastic assembly processes for high reliability applications using HAST and assembly test chips

J. N. Sweet, D. W. Peterson, J. A. Emerson, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

Physical Models for Predicting the Effect of Atmospheric Corrosion on Microelectronic Reliability

David G. Robinson, J. N. Sweet, K. L. Erickson, 2000 .

Development of solid state moisture sensors for semiconductor fabrication applications

J. N. Sweet, D. W. Peterson, T. R. Guilinger, 1994 .

Short and long loop manufacturing feedback using multi-sensor assembly test chip

D. W. Palmer, J. N. Sweet, D. W. Peterson, 1990, Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade.

Analysis and measurement of thermal resistance in a 3-dimensional silicon multichip module populated with assembly test chips

B. L. Bainbridge, J. N. Sweet, D. Chu, 1993, [1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

HAST evaluation of organic liquid IC encapsulants using Sandia's assembly test chips

J. N. Sweet, D. W. Peterson, J. Sweet, 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.