Martin Goosey

发表

Electronic Circuits World Convention, Cologne, Germany 7-9 October 2002

Martin Goosey, M. Goosey, 2003 .

A new method for destroying organic contaminants and recycling waste water from printed circuit board manufacturing process effluent streams

Martin Goosey, Neil Wright, Martin Potter, 2003 .

IeMRC – CAFMAD Workshop on Novel Electronic Materials

Martin Goosey, 2010 .

Materials Used in Manufacturing Electrical and Electronic Products

Martin Goosey, Gary C. Stevens, G. Stevens, 2008 .

Recycling technologies for the treatment of end of life printed circuit boards (PCBs)

Martin Goosey, Rod Kellner, M. Goosey, 2003 .

Integrated Passive Component Technology

Martin Goosey, 2004 .

Research to Industry Electronics Conference: Connecting Research to Industry

Martin Goosey, 2012 .

End‐of‐life electronics legislation – an industry perspective

Martin Goosey, 2004 .

EPTC 2008 – Electronics Packaging Technology Conference, 9-12 December, Grand Copthorne Waterfront Hotel, Singapore

Martin Goosey, 2009 .

ICT Evening Seminar

Martin Goosey, M. Goosey, 2008 .

Energy conservation and related best practices in printed circuit board (PCB) manufacturing

Martin Goosey, Rod Kellner, M. Goosey, 2010 .

Large area electronics: addressing the applications challenge

Martin Goosey, 2013 .

Susonence – a new multi-partner project developing advanced sonochemical processes to reduce chemical usage and decrease waste in the PCB and metal finishing industries

Martin Goosey, 2012 .

Environment-friendly electronics: lead free technology

Martin Goosey, M. Goosey, 2002 .

An introduction to high performance laminates and the importance of using optimised chemical processes in PCB fabrication

Martin Goosey, Mark A. Poole, M. Goosey, 2004 .

Water use in the printed circuit board manufacturing process and approaches for reducing consumption

Martin Goosey, 2005 .

An integrated approach to electronic waste (WEEE) recycling

Martin Goosey, Narinder Bains, Rod Kellner, 2007 .

Northern UK Circuit Group (NUKCG) Spring Seminar

Martin Goosey, 2005 .

"Changing circumstances – new possibilities", The EIPC Spring Conference 2003

Martin Goosey, Peter Starkey, 2004 .

New chemical process waste treatment technologies for a sustainable printed circuit board manufacturing process

Martin Goosey, Narinder Bains, Rod Kellner, 2008 .

Handbook of Thick Film Technology – 2nd edition

Martin Goosey, 2006 .

New R&D funding support announced by the UKs Innovative electronics Manufacturing Research Centre (IeMRC)

Martin Goosey, 2012 .

New Chemistries for Advanced Printed Circuit Board Fabrication

Martin Goosey, 1992 .

Environmental best practice in the PCB industry

Martin Goosey, 2000 .

New technologies for a sustainable printed circuit board manufacturing process: further results

Martin Goosey, Narinder Bains, Kate Geraghty, 2005 .

Conference review - HKPCA/IPC International Technical Conference on Green Manufacturing, Dongguang, China, 1 and 2 December 2005

Martin Goosey, 2006 .

The impact of the climate change levy on the UK PCB industry

Martin Goosey, 2001 .

3D Packaging Seminar TWI, Granta Park, Abington, Cambridge – 23 May 2012

Martin Goosey, 2012 .

A short introduction to graphene and its potential interconnect applications

Martin Goosey, M. Goosey, 2012 .

The board authority live – the impact of green technology, 4 October 2005

Martin Goosey, 2006 .

Green Photonics ConferenceMillennium Centre, Cardiff19 October 2010

Martin Goosey, 2011 .

Institute of Materials, Minerals and Mining – Materials Congress 2004

Martin Goosey, 2004 .

Review of the IeMRC's First Annual Conference

Pete Starkey, Martin Goosey, 2007 .

Implementation of the RoHS directive and compliance implications for the PCB sector

Martin Goosey, 2007 .

Institute of Circuit Technology Annual Symposium

Martin Goosey, 2007 .

eFutures Academic Community MeetingGlaziers Hall, London, 8 October 2010

Martin Goosey, 2011 .

Recovery of copper from PCB manufacturing effluent using chitin and chitosan

Martin Goosey, Rod Kellner, M. Goosey, 2012 .

iMAPS – Basic Packaging Workshop, 4 December 2008, Unisem Europe Ltd, Croespenmaen, Newport

Martin Goosey, 2009 .

ASPIS – a new multi-partner research project to enhance the performance of nickel–gold solderable finishes

Martin Goosey, 2011 .

EIPC Summer Conference 2009

Martin Goosey, 2009 .

Electronics Goes Green 2004

Martin Goosey, 2005 .

Manufacturing Technology Centre – Electronics Manufacturing LaunchAnsty Park, Coventry19 August 2010

Martin Goosey, 2011 .

2004 International Conference on WEEE and RoHS, Guangzhou, China, 10 and 11 June

Martin Goosey, 2005 .

Development of a new, more efficient and environmentally friendly method of producing high density interconnects – the “PRIME” process

Martin Goosey, Narinder Bains, David Starkey, 2001 .

Soldering considerations for lead‐free printed circuit board assembly – an Envirowise Guide

Martin Goosey, 2005 .

EIPC/IPC Executive Market and Technology Forum Conference, Copenhagen, 11 and 12 October 2007

Martin Goosey, 2007 .

EIPC Spring Conference Review

Martin Goosey, 2003 .

IEEE CPMT Symposium on Green Electronics, Chalmers University of Technology, Gothenburg

Martin Goosey, 2007 .

Packaging and Interconnection for Electronics and Sensors – Past, Present and Future. A seminar to mark the retirement of David Pedder

Martin Goosey, 2010 .

Electronic Circuits World Convention 10 (ECWC 10) 2005

Martin Goosey, 2005 .

Dissemination Seminar: Results from Applied Research Projects in the Surface Engineering and Printed Circuit Sectors Surface Engineering Association, Federation House, Vyse Street, Birmingham 29 June 2012

Martin Goosey, 2012 .

An overview of the current status of lead‐free assembly and related issues

Martin Goosey, 2003 .

Factors influencing the formation of “black pad” in electroless nickel‐immersion gold solderable finishes—a processing perspective

Martin Goosey, M. Goosey, 2002 .

Evaluation of an enhanced oxidation method for the destruction of ethylene diamine tetra‐acetic acid (EDTA) and related compounds in aqueous solution

Martin Goosey, Narinder Bains, Runveer Hayer, 2003 .