Akio Katsumata

Prototype of standalone tsunami alarm equipment

Yutaka Hayashi, Toshitaka Baba, Akio Katsumata, 2015 .

Focused technologies in near future from OSAT view point

Norio Ito, Akira Takashima, Akio Katsumata, 2017, 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM).

A New Embedded Package Structure and Technology for the Next Generation of WLP, the Wafer level Fun-Out Package - WFOP (TM)

Akio Katsumata, 2013 .

A new embedded die package — WFOP™

Naoki Hayashi, Hiroshi Inoue, Takahiro Yada, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

A novel Wafer level Fan-out Package (WFOP™) applicable to 50um pad pitch interconnects

Naoki Hayashi, Takanori Kondo, Tomoko Takahashi, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Optimization of Preset Parameters for Source Process Analysis with Teleseismic Body-Wave

Kenichi Fujita, Akio Katsumata, Koji Sakoda, 2015 .

Low‐frequency continuous tremor around the Moho discontinuity away from volcanoes in the southwest Japan

Akio Katsumata, A. Katsumata, Noriko Kamaya, 2003 .

Comparison of magnitudes estimated by the Japan Meteorological Agency with moment magnitudes for intermediate and deep earthquakes

Akio Katsumata, A. Katsumata, 1996, Bulletin of the Seismological Society of America.