Y. Mignot

Plasma etch challenges for porous low-k materials for 32nm and beyond

C. Labelle, R. Srivastava, Y. Yin, 2012, Advanced Lithography.

BEOL process integration for the 7 nm technology node

F. Mont, T. Spooner, X. Zhang, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Tungsten and cobalt metallization: A material study for MOL local interconnects

F. Chafik, F. Mont, B. Haran, 2016, 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via

Yongan Xu, Yunpeng Yin, Chiew-seng Koay, 2012, 2012 IEEE International Interconnect Technology Conference.