Tu Anh Tran

Novel method of separating probe and wire bond regions without increasing die size and reducing weak fab-back end of line adhesion interfaces

Bill Williams, Jody Ross, Chu-Chung Lee, 2006 .

Assembly challenges related to fine pitch in-line and staggered bond pad devices

Fuaida Harun, Tu Anh Tran, M. Ruston, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Fine pitch probing and wirebonding and reliability of aluminum capped copper bond pads

Scott Chen, Tu Anh Tran, Lois Yong, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Fine pitch 2nd bond evaluation for PBGA packages: Process capability and reliability assessments

Fuaida Harun, Tu Anh Tran, Lois Yong, 2001 .

Integration of a mechanically reliable 65-nm node technology for low-k and ULK interconnects with various substrate and package types

V. Fiori, S. Orain, C. Goldberg, 2005, Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..

Fine pitch probing and wire bonding and reliability of multi-layer Copper interconnect structures

L. L. Mercado, B. Williams, Tu Anh Tran, 2000 .