Mariappan Murugesan

发表

New concept of TSV formation methodology using Directed Self-Assembly (DSA)

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions

Masahiro Aoyagi, Mitsumasa Koyanagi, Mariappan Murugesan, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack

Mitsumasa Koyanagi, Kang Wook Lee, Katsuyuki Sakuma, 2009, 2009 IEEE International Conference on 3D System Integration.

Development of via-last 3D integration technologies using a new temporary adhesive system

Mitsumasa Koyanagi, Kang Wook Lee, Takafumi Fukushima, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2016, Micromachines.

Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study

Tetsu Tanaka, Takafumi Fukushima, K. W. Lee, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2009, 2009 IEEE International Conference on 3D System Integration.

3D memory chip stacking by multi-layer self-assembly technology

Mitsumasa Koyanagi, Kang Wook Lee, Takafumi Fukushima, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV

H. Wang, Mitsumasa Koyanagi, Kang Wook Lee, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Temporary bonding strength control for self-assembly-based 3D integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2015, 2015 IEEE International Reliability Physics Symposium.

High density Cu-TSVs and reliability issues

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV

Mitsumasa Koyanagi, Takafumi Fukushima, K. W. Lee, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Die-Level 3-D Integration Technology for Rapid Prototyping of High-Performance Multifunctionality Hetero-Integrated Systems

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2013, IEEE Transactions on Electron Devices.

Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal

Takafumi Fukushima, Mariappan Murugesan, H. Hashimoto, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI

Tetsu Tanaka, S. Kimura, Takafumi Fukushima, 2014, 2014 International 3D Systems Integration Conference (3DIC).

3D Integration and Reliability Challenges

Mitsumasa Koyanagi, Kang-Wook Lee, Takafumi Fukushima, 2013 .

W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2011, Micromachines.

Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding

Mitsumasa Koyanagi, Kang Wook Lee, Tetsu Tanaka, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology

Mitsumasa Koyanagi, Tetsu Tanaka, Takafumi Fukushima, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

Impacts of 3-D Integration Processes on Memory Retention Characteristics in Thinned DRAM Chip for High-Reliable 3-D DRAM

Mitsumasa Koyanagi, Takafumi Fukushima, Mariappan Murugesan, 2014, IEEE Transactions on Electron Devices.

Impacts of Cu Contamination on Device Reliabilities in 3-D IC Integration

Mitsumasa Koyanagi, Takafumi Fukushima, Mariappan Murugesan, 2014, IEEE Transactions on Device and Materials Reliability.

Barrier Properties of CVD Mn Oxide Layer to Cu Diffusion for 3-D TSV

Mitsumasa Koyanagi, Takafumi Fukushima, Mariappan Murugesan, 2014, IEEE Electron Device Letters.

Investigation of Local Bending Stress Effect on Complementary Metal-Oxide-Semiconductor Characteristics in Thinned Si Chip for Chip-to-Wafer Three-Dimensional Integration (Special Issue : Solid State Devices and Materials)

Hisashi Kino, Mariappan Murugesan, Ji Choel Bea, 2013 .

Stress Mapping in Thinned Si Wafer with Cu-TSV and Cu-Sn Microbumps

Mariappan Murugesan, Koyanagi Mitsumasa, Fukushima Takafumi, 2011 .

Characteristics of Copper Spiral Inductors Utilizing FePt Nanodot Films

Mitsumasa Koyanagi, Takafumi Fukushima, Akihiro Noriki, 2009 .