Yuan Lu

Circuit modeling and structure optimization of integrated passive inductors

Xiaoli Ren, Jie Pan, Daquan Yu, 2014, 2014 15th International Conference on Electronic Packaging Technology.

A new 2.5D TSV package assembly approach

Lixi Wan, Wen Yin, Daquan Yu, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Optimization design and simulation for a band-pass-filter with IPD technology for RF front-end application

Xiaoli Ren, Jie Pan, Daquan Yu, 2014, 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.

Three‐dimensional beam–truss model for reinforced concrete walls and slabs – part 2: modeling approach and validation for slabs and coupled walls

Marios Panagiotou, Yuan Lu, M. Panagiotou, 2016 .

The Study of the Digital Three-Phase Phase-Locked Loop in the Photovoltaic Grid System

Xiao Li Lu, Xiao Ou Song, Yuan Lu, 2013 .

Thermal management of 3D RF PoP based on ceramic substrate

Fengman Liu, Liqiang Cao, Fengze Hou, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

A shielding structure with conductive adhesive coated on molding compound in 3D package

Liqiang Cao, Jun Li, Lixi Wan, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

Effect of IMC growth on thermal cycling reliability of micro solder bumps

Cheng Xu, Dongkai Shangguan, Daquan Yu, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

Thermo-mechanical reliability study for 3D package module based on flexible substrate

Liqiang Cao, Fengze Hou, Lixi Wan, 2013, 2013 14th International Conference on Electronic Packaging Technology.