Ingrid De Wolf

Eric Beyne, Christopher J. Wilson, Ingrid De Wolf, 2014, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Method for aligning micro-electronic components (US Application no. 14/576637 - Patent Publ. no. US20150179605 A1)

Eric Beyne, Ingrid De Wolf, Vikas Dubey, 2015 .

Impact of design factors and environment on the ESD sensitivity of MEMS micromirrors

Sandeep Sangameswaran, Guido Groeseneken, Ingrid De Wolf, 2010, Microelectron. Reliab..

Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions

Bart Vandevelde, Eric Beyne, Mario Gonzalez, 2013 .

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures

Ingrid De Wolf, Riet Labie, Bert Verlinden, 2012, Microelectron. Reliab..

Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing

Philippe Roussel, Ivan Ciofi, Ingrid De Wolf, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Editorial

A. J. Mouthaan, Guido Groeseneken, Ingrid De Wolf, 1996, Microelectron. Reliab..

In-line metrology and inspection for process control during 3D stacking of IC's

Eric Beyne, Sandip Halder, Mireille Maenhoudt, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

The first observation of p-type electromigration failure in full ruthenium interconnects

Ingrid De Wolf, Kris Croes, Zsolt Tokei, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Eric Beyne, Luka Kljucar, Ingrid De Wolf, 2017, Microelectron. Reliab..

Stress Engineering in Si Based Micro Structures Using Technology Computer-Aided Design( the IEEE International Conference on SISPAD '02)

Ingrid De Wolf, Vincent Senez, Herve Jaouen, 2003 .

Study of glass frit induced stiction using a micromirror array

Ingrid De Wolf, Ann Witvrouw, Jeroen De Coster, 2012, Microelectron. Reliab..

Generic RF-MEMS technology platform for mobile and satellite communications

Anne Jourdain, Kristof Vaesen, Bart Nauwelaers, 2005 .

PCB technology based stretchable circuits

Mario Gonzalez, Jan Vanfleteren, Frederick Bossuyt, 2013 .

Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach

Ingrid De Wolf, Kris Croes, Christopher J. Wilson, 2011, Microelectron. Reliab..

B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages

Bart Vandevelde, C. S. Wong, Ingrid De Wolf, 2016, Microelectron. Reliab..

Electrical characterization and reliability study of integrated GaN power amplifier in multi-layer thin-film technology

Rui Liu, Ingrid De Wolf, J. Das, 2011, Microelectron. Reliab..

Failure analysis challenges for 3D stacked ICs

Dimitri Linten, Ingrid De Wolf, Alain Phommahaxay, 2014 .

Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis

A. Khaled, S. Brand, M. Kögel, 2016, Microelectron. Reliab..

Impact of oxide liner properties on TSV Cu pumping and TSV stress

Bart Vandevelde, Eric Beyne, Ingrid De Wolf, 2015, 2015 IEEE International Reliability Physics Symposium.

A comprehensive model to predict the charging and reliability of capacitive RF MEMS switches

Robert Puers, Robert Mertens, Ingrid De Wolf, 2004 .

A low frequency electrical test set-up for the reliability assessment of capacitive RF MEMS switches

Robert Puers, Robert Mertens, Ingrid De Wolf, 2003 .

Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch

Ingrid De Wolf, Zsolt Tokei, Kristof Croes, 2019, 2019 IEEE International Reliability Physics Symposium (IRPS).

Functionality, yield and reliability analysis of SiGe micro-mirrors using automated optical measurement techniques

Ingrid De Wolf, Ann Witvrouw, Luc Haspeslagh, 2009 .

The reliability of RF-MEMS: failure modes, test procedures, and instrumentation

Ingrid De Wolf, 2004 .

Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR)

Ingrid De Wolf, Frank Altmann, Kristof J. P. Jacobs, 2021, 2021 IEEE 17th International Conference on Automation Science and Engineering (CASE).

Origin of substrate hole current after gate oxide breakdown

Guido Groeseneken, Robin Degraeve, Ingrid De Wolf, 2002 .

The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects

Jan Vanfleteren, Mario Gonzalez, Frederick Bossuyt, 2011 .

Mechanical characterization of poly-SiGe layers for CMOS–MEMS integrated application

Robert Puers, Ingrid De Wolf, Ann Witvrouw, 2009 .

Failure and Stress Analysis of Cu TSVs using GHz-Scanning Acoustic Microscopy and Scanning Infrared Polariscopy

Matthias Wagner, Ingrid De Wolf, Martin Herms, 2015 .

Study of damage and stress induced by backgrinding in Si wafers

Ingrid De Wolf, I. Wolf, Jian Chen, 2003 .

Light-induced capacitance alteration for non-destructive fault isolation in TSV structures for 3-D integration

Mario Gonzalez, Ingrid De Wolf, Michele Stucchi, 2016 .

Advanced RF MEMS: Reliability

Ingrid De Wolf, 2010 .

Out-of-plane electrostatic interdigitated actuator

Bart Nauwelaers, Robert Mertens, Xavier Rottenberg, 2006 .

Effect of test structure on electromigration characteristics in 3D-TSV stacked devices

Eric Beyne, Ingrid De Wolf, Joeri De Vos, 2014 .

Impact of thinning and packaging on a deep submicron CMOS product

Mark Nakamoto, Mario Gonzalez, Ingrid De Wolf, 2009 .

Strain determination in silicon microstructures by combined convergent beam electron diffraction, process simulation, and micro-Raman spectroscopy

Ingrid De Wolf, Vincent Senez, G. Carnevale, 2003 .

The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit

Jan Vanfleteren, Mario Gonzalez, Frederick Bossuyt, 2010 .

Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects

Eric Beyne, Ingrid De Wolf, Bjorn Vandecasteele, 2015 .

A simple, cost effective and very sensitive alternative for photon emission spectroscopy

Guido Groeseneken, Ingrid De Wolf, Herman Maes, 1997 .

Reliability and Failure Analysis of RF MEMS Switches

Anne Jourdain, Ingrid De Wolf, Ann Witvrouw, 2002 .

Application of 3D X-ray microscopy for 3D IC process development

Ingrid De Wolf, Allen Gu, Teng Wang, 2016 .

Raman spectroscopy: about chips and stress

Ingrid De Wolf, I. Wolf, 2003 .

Failure and stress analysis of Cu TSVs using GHz-scanning acoustic microscopy and polariscopy

Ingrid De Wolf, 2015 .

Raman Spectroscopy Analysis Of Mechanical Stress Near Cu‐TSVs

Ingrid De Wolf, 2011 .

Stiction reduction in electrostatic poly-SiGe micromirrors by applying a self-assembled monolayer film

Jean-Pierre Celis, Ingrid De Wolf, Jeroen De Coster, 2010 .

Stress measurements in silicon devices through Raman spectroscopy: Bridging the gap between theory and experiment

Ingrid De Wolf, Herman Maes, H. Maes, 1996 .

In situ observations on deformation behavior and stretching-induced failure of fine pitch stretchable interconnect

Jan Vanfleteren, Mario Gonzalez, Frederick Bossuyt, 2009 .

Optical methods for the reliability and failure analysis of RF MEMS

Ingrid De Wolf, W. M. van Spengen, 2005 .

Effect of test structure on electromigration characteristics in three-dimensional through silicon via stacked devices

Eric Beyne, Ingrid De Wolf, Joeri De Vos, 2015 .

Impact of biasing scheme and environment conditions on the lifetime of RF-MEMS

Robert Puers, Xavier Rottenberg, Ingrid De Wolf, 2005 .

Finite element analysis of thermo-elastical modal damping of MEMS vibrations

Ingrid De Wolf, Hendrikus Tilmans, Steve Stoffels, 2007 .

Stress measurements in Si microelectronics devices using Raman spectroscopy

Ingrid De Wolf, I. Wolf, 1999 .

Analysis of local mechanical stresses in and near tungsten lines on silicon substrate

Ingrid De Wolf, Herman Maes, Michel Ignat, 1999 .

Compact thermal modeling of hot spots in advanced 3D-stacked structures

Bart Vandevelde, Eric Beyne, Ingrid De Wolf, 2009, EPTC 2009.

Hydrogen outgassing induced liner/barrier reliability degradation in through silicon via's

Eric Beyne, Ingrid De Wolf, Stefaan Van Huylenbroeck, 2014 .

Advanced experimental back-end-of-line (BEOL) stability test

Geert Van der Plas, Mario Gonzalez, Ingrid De Wolf, 2015 .

Polysilicon Encapsulated LOCOS for Deep Submicron CMOS Lateral Isolation

Rita Rooyackers, Ludo Deferm, Ingrid De Wolf, 1996 .