B. Garben

Evolution of organic chip packaging technology for high speed applications

E. Klink, D. Kaller, G.A. Katopis, 2004, IEEE Transactions on Advanced Packaging.

Package and chip design optimization for mid-frequency power distribution decoupling

G.A. Katopis, B. Garben, W.A. Becker, 2002, Electrical Performance of Electronic Packaging,.

Novel methodology for mid-frequency delta-I noise analysis of complex computer system boards and verification by measurements

M. F. McAllister, B. Garben, 2000, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524).

Novel organic chip packaging technology and impacts on high speed interfaces

E. Klink, D. Kaller, S. Grivet-Talocia, 2002, Electrical Performance of Electronic Packaging,.

Influence of damping and voltage dependent leakage resistance on mid-frequency power noise

B. Garben, A. Paech, 2004, Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects.