I. Anjoh

Chip scale packaging for memory devices

Asao Nishimura, Y. Akiyama, I. Anjoh, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Advanced IC packaging for the future applications

I. Anjoh, A. Nishimura, S. Eguchi, 1998 .

Development of low-cost and highly reliable wafer process package

I. Anjoh, A. Kazama, A. Nishimura, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).