Karlheinz Bock

Karlheinz Bock, Karsten M. Decker, K. M. Decker, 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Reliability Testing of FCCSP Packages for Automotive Applications

Karlheinz Bock, Karsten Meier, Laura Wambera, 2020, 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).

Foreword: Special Section on Advanced Packaging, Materials, Processing, and Reliability: Cutting-Edge Solutions for High-Density Wafer-/Panel-Level and Thin, Flexible, Mobile Packages

Karlheinz Bock, 2020 .

Stereolithographic printed polymers on ceramic for 3D-opto-MID

Karlheinz Bock, Lukas Lorenz, Thomas Ackstaller, 2020, Photonics Europe.

A Robust Multi-Stage Scheduling Approach for Semiconductor Manufacturing Production Areas with Time Contraints

Marcel Stehli, Karlheinz Bock, Christian Maleck, 2019, 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).

A CP MODEL FOR A SCHEDULING PROBLEM WITH LIMITED SECONDARY RESOURCES COMPARED TO A DES MODEL

Karlheinz Bock, Dirk Doleschal, 2018, 2018 Winter Simulation Conference (WSC).

Experimental methodology for low temperature vibration investigations on electronic modules

Karlheinz Bock, Tobias Tiedje, Karsten Meier, 2016, 2016 39th International Spring Seminar on Electronics Technology (ISSE).

“Sensor-filter”—Intelligent micro filter system in foil technology

Karlheinz Bock, Martin Alberti, L. Meixner, 2013 .

Roll-To-Roll Microfabrication of Polymer Microsystems

Michael Feil, Karlheinz Bock, Christof Strohhöfer, 2007 .

Energy-Efficient Transceivers for Ultra-Highspeed Computer Board-to-Board Communication

Gerhard Fettweis, Corrado Carta, Frank Ellinger, 2015, 2015 IEEE International Conference on Ubiquitous Wireless Broadband (ICUWB).

Approach for the production chain of printed polymer optical waveguides-an overview.

Jörg Franke, Ludger Overmeyer, Karlheinz Bock, 2017, Applied optics.

Evaluation of the coupling performance and long-term stability of aerosol jet printed and photolithographic manufactured waveguides for asymmetric optical bus couplers

Karlheinz Bock, Jörg Franke, Krzysztof Nieweglowski, 2019, OPTO.

Investigations of the influence of dicing techniques on the strength properties of thin silicon

Karlheinz Bock, Christof Landesberger, Matthias Ebert, 2007, Microelectron. Reliab..

Tunable broadband integrated circuits for adaptive optical interconnects

Ronny Henker, Frank Ellinger, Guido Belfiore, 2017, Other Conferences.

Micro structured coupling elements for 3D silicon optical interposer

Karlheinz Bock, Dirk Plettemeier, Niels Neumann, 2017, Optics + Optoelectronics.

Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems

Karlheinz Bock, Krzysztof Nieweglowski, Tobias Tiedje, 2018, Microelectron. Reliab..

Capacitive coupled TLP (CC-TLP) and the correlation with the CDM

Charvaka Duvvury, Karlheinz Bock, Yen-Yi Lin, 2009, 2009 31st EOS/ESD Symposium.

Architecture and Advanced Electronics Pathways Toward Highly Adaptive Energy- Efficient Computing

Christel Baier, Frank Ellinger, Wolfgang Lehner, 2019, Proceedings of the IEEE.

Optical Beam Propagation and Ray Tracing Simulation of Interruption-Free Asymmetric Multimode Bus Couplers

Klaus-Jurgen Wolter, Karlheinz Bock, Norbert Lindlein, 2017 .

Investigation into socketed CDM (SDM) tester parasitics

Karlheinz Bock, M. Chaine, Horst Gieser, 1999 .

ESD protection methodology for deep-sub-micron CMOS

Guido Groeseneken, Karlheinz Bock, Herman Maes, 1998 .

Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequency RFID tags

Karlheinz Bock, Indranil Bose, Kornelius Tetzner, 2014, Microelectron. Reliab..

Roll-to-roll processing of film substrates for hybrid integrated flexible electronics

Karlheinz Bock, Sonia Marin, Christof Landesberger, 2018 .

Simulation of bended planar waveguides for optical bus-couplers

Karlheinz Bock, Krzysztof Nieweglowski, Lukas Lorenz, 2016, Photonics Europe.

Packaging for MEMS devices: stumbling block or enabling solution?

Jürgen Wolf, Karlheinz Bock, Maik Wiemer, 2002, Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS.

Influence of gate length on ESD-performance for deep sub micron CMOS technology

Guido Groeseneken, Karlheinz Bock, A. Naem, 1999, Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 1999 (IEEE Cat. No.99TH8396).

Polytronik und das Internet der Dinge

Karlheinz Bock, K. Bock, 2007, Internet der Dinge.

Multimode Bus Coupler for Device Communication Integrated in 3D-Opto-MID

Karlheinz Bock, Krzysztof Nieweglowski, Lukas Lorenz, 2021, Journal of Microelectronics and Electronic Packaging.

Influence on the optical performance of droplets and enclosures in printed polymer optical waveguides

Jörg Franke, Stefan Kaierle, Ludger Overmeyer, 2021, OPTO.

Electronic module assembly

Jörg Franke, Lihui Wang, Karlheinz Bock, 2021, CIRP Annals.

Asymmetric Optical Bus Coupler for Interruption-Free Short-Range Connections on Board and Module Level

Jörg Franke, Karlheinz Bock, Dirk Plettemeier, 2017, Journal of Lightwave Technology.

Assembly of optical transceivers for board-level optical interconnects

Karlheinz Bock, Krzysztof Nieweglowski, K. Bock, 2016 .

Ultra-thin Wafer Fabrication Through Dicing-by-Thinning

Karlheinz Bock, Christof Landesberger, Sabine Scherbaum, 2011 .

Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications

Karlheinz Bock, Mike Roellig, Karsten Meier, 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Microfluidic Detection Module For DNA Analysis Using Integrated Microheaters and DNA Microarrays On Plastic Foil

Karlheinz Bock, Aman Russom, Anna Ohlander, 2014 .

Analysis of Bending Effects for Optical-Bus-Couplers

Karlheinz Bock, Klaus-Jurgen Wolter, Krzysztof Nieweglowski, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Trends in RF & Wireless Packaging

Herbert Reichl, Karlheinz Bock, Jürgen Wolf, 2004 .

3D printed flexible substrate with pneumatic driven electrodes for health monitoring

Hagen Malberg, Sebastian Zaunseder, Karlheinz Bock, 2017, 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.

Plasma dicing enables high accuracy self-alignment of thin silicon dies for 3D-device-integration

Karlheinz Bock, Josef Weber, Christof Landesberger, 2012, 2012 4th Electronic System-Integration Technology Conference.

Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates

Karlheinz Bock, Christof Landesberger, Christoph Kutter, 2015, 2015 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME).

Multichannel optical link based on polymer multimode waveguides for board-level interchip communication

Karlheinz Bock, Klaus-Jurgen Wolter, Krzysztof Nieweglowski, 2015, 2015 European Microelectronics Packaging Conference (EMPC).

Polymer opto-electronic-fluidic detection module on plastic film substrates

Karlheinz Bock, Christof Landesberger, Anna Ohlander, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending

Karlheinz Bock, Christof Landesberger, Detlef Bonfert, 2015, 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME).

Biosensor for calcium based on a hydrogel optical waveguide with integrated sensor proteins

Karlheinz Bock, Martin Danko, Igor Krupa, 2009, TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.

Automated 10-channel capillary chip immunodetector for biological agents detection.

Karlheinz Bock, Hans Wolf, Waltraud Hell, 2007, Biosensors & bioelectronics.

Combination of Thick-Film Hybrid Technology and Polymer Additive Manufacturing for High-Performance Mechatronic Integrated Devices

Karlheinz Bock, Krzysztof Nieweglowski, Lukas Lorenz, 2019, 2019 42nd International Spring Seminar on Electronics Technology (ISSE).

Reliability characterization of blind-hole vias for a System-in-Foil

Karlheinz Bock, Metin Koyuncu, Enno Lorenz, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

Characterization of polymeric encapsulation for implantable microsystems applying dynamic fluidic and electrical load

Karlheinz Bock, Tetiana Voitsekhivska, Sabine Kirsten, 2015, 2015 38th International Spring Seminar on Electronics Technology (ISSE).

Micro-contact printing of OTFT on polymer foils

Karlheinz Bock, Gerhard Klink, Martin Konig, 2009, 2009 59th Electronic Components and Technology Conference.

Pulsed behavior of polymer protection devices

Ciprian Ionescu, Karlheinz Bock, Paul Svasta, 2009, 2009 32nd International Spring Seminar on Electronics Technology.

Microfluidics on foil: State of the art and new developments

Martin Richter, Karlheinz Bock, Gerhard Klink, 2008 .

Investigations of the fracture strength of thin silicon dies embedded in flexible foil substrates

Karlheinz Bock, Christof Landesberger, Nagarajan Palavesam, 2014, 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME).

Broadband interconnect design for silicon-based system-in-package applications up to 170 GHz

Thomas Merkle, Karlheinz Bock, Joo-Young Choi, 2013, 2013 European Microwave Conference.

Low cost, rigid to flex interposer using a spray coated intrinsically conductive polymer in a roll to-roll process

Karlheinz Bock, Detlef Bonfert, Indranil Bose, 2014, 2014 IEEE 20th International Symposium for Design and Technology in Electronic Packaging (SIITME).

3D Optical Coupling Techniques on Polymer Waveguides for Wafer and Board Level Integration

Karlheinz Bock, Sebastian Killge, Krzysztof Nieweglowski, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Roll-to-roll hot embossing of microstructures

Karlheinz Bock, Christof Landesberger, Herbert Schuck, 2010, 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP).

Pulsed stress behavior of platinum thin films

Ciprian Ionescu, Karlheinz Bock, Paul Svasta, 2010, 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME).

Genotyping of single nucleotide polymorphisms by melting curve analysis using thin film semi-transparent heaters integrated in a lab-on-foil system.

Karlheinz Bock, Aman Russom, Marcella Chiari, 2013, Lab on a chip.