Satish Bonam

Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration

Tamal Ghosh, Shiv Govind Singh, Siva Rama Krishna Vanjari, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC

Shiv Govind Singh, Asisa Kumar Panigrahi, Satish Bonam, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding

Tamal Ghosh, Shiv Govind Singh, Siva Rama Krishna Vanjari, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration

Shiv Govind Singh, Suraj Patil, Asisa Kumar Panigrahi, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure

Siva Rama Krishna Vanjari, Asisa Kumar Panigrahi, Satish Bonam, 2016 .

High Quality Fine-Pitch Cu-Cu Wafer-on-Wafer Bonding with Optimized Ti Passivation at 160°C

Siva Rama Krishna Vanjari, Asisa Kumar Panigrahi, Satish Bonam, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).