S. Connor

Noise coupling between power/ground nets due to differential vias transitions in a multilayer PCB

B. Archambeault, J.L. Drewniak, J. Fan, 2008, 2008 IEEE International Symposium on Electromagnetic Compatibility.

Numerical and Experimental Investigation of Power Supply Noise Decoupling Strategies on Single-Sided Printed Circuit Boards

C. Rostamzadeh, B. Archambeault, S. Connor, 2007, 2007 IEEE International Symposium on Electromagnetic Compatibility.

Analysis of noise coupling result from overlapping power areas within power delivery networks

B. Archambeault, J.L. Drewniak, Gang Feng, 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..

Time domain simulation of the effect of decoupling capacitor location on printed circuit boards

B. Archambeault, J. Diepenbrock, S. Connor, 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..

FDTD analysis of symmetric TEM cell

C. Rostamzadeh, B. Archambeault, S. Connor, 2005, 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005..

The importance of using time domain to analyze the effect of decoupling capacitor performance on printed circuit boards

B. Archambeault, Liang Xue, G. Selli, 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..

Noise coupling between signal and power/ground nets due to signal vias transitioning through power/ground plane pair

B. Archambeault, J.L. Drewniak, J. Fan, 2008, 2008 IEEE International Symposium on Electromagnetic Compatibility.

Time domain gating of frequency domain S-parameter data to remove connector end effects for PCB and cable applications

B. Archambeault, S. Connor, J.C. Diepenbrock, 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..

Fast frequency domain crosstalk analysis for board-level EMC rule checking and optimization

B. Archambeault, V. Jandhyala, S. Connor, 2008, 2008 IEEE International Symposium on Electromagnetic Compatibility.