J.H.J. Janssen

Thermal transient modeling and experimental validation in the European project PROFIT

A. Morelli, D. Schweitzer, H. Pape, 2004, IEEE Transactions on Components and Packaging Technologies.

Virtual Design and Qualification of IC Backend Structures

W.D. van Driel, G.Q. Zhang, J.H.J. Janssen, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Using compact models in the early thermal design of electronics

H. J. Eggink, J.H.J. Janssen, G. M. Janssen, 2003, Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003..

Spatial and temporal temperature variations in CMOS designs

J.H.J. Janssen, H.J.M. Veendrick, 2009, 2009 15th International Workshop on Thermal Investigations of ICs and Systems.

Influence of material combinations on delamination failures in a cavity-down TBGA package

W.D. van Driel, Xuejun Fan, J.H.J. Janssen, 2004, IEEE Transactions on Components and Packaging Technologies.

Warpage minimization of the HVQFN map mould

W.D. van Driel, K.M.B. Jansen, D.G. Yang, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

W. D. van Driel, Leo J. Ernst, Daoguo Yang, 2003 .

Measuring and modeling the cure-dependent rubbery moduli of epoxy molding compound

K.M.B. Jansen, D.G. Yang, G.Q. Zhang, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Viscoelastic characterization of fast curing moulding compounds

K.M.B. Jansen, J.H.J. Janssen, H.J.L. Bressers, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

K.M.B. Jansen, D.G. Yang, J.H.J. Janssen, 2005, 2005 6th International Conference on Electronic Packaging Technology.