R. L. Shook
发表
R. L. Shook,
T. R. Conrad,
V. S. Sastry,
1995
.
R. L. Shook,
T. R. Conrad,
R.L. Shook,
1993,
31st Annual Proceedings Reliability Physics 1993.
Influence of preheat and maximum temperature of the solder-reflow profile on moisture sensitive IC's
R. L. Shook,
V. S. Sastry,
V. Sastry,
1997,
1997 Proceedings 47th Electronic Components and Technology Conference.
R. L. Shook,
J. P. Goodelle,
J. Goodelle,
1999,
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
David L. Crouthamel,
R. L. Shook,
A. Dairo,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
R. L. Shook,
D. L. Gerlach,
B. T. Vaccaro,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
R. L. Shook,
D. L. Gerlach,
B. T. Vaccaro,
1998,
1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).
R. L. Shook,
T. R. Conrad,
1994,
1994 Proceedings. 44th Electronic Components and Technology Conference.
R. L. Shook,
J. Osenbach,
J. Delucca,
2007,
IEEE Transactions on Electronics Packaging Manufacturing.
R. L. Shook,
J. Osenbach,
P. Suratkar,
2005,
IEEE Transactions on Electronics Packaging Manufacturing.
R. L. Shook,
J. Osenbach,
J.W. Osenbach,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
R. L. Shook,
J. Hirth,
R. Rapp,
1985
.
R. L. Shook,
1992,
30th Annual Proceedings Reliability Physics 1992.
R. L. Shook,
T. R. Conrad,
V. Sastry,
1995,
1995 Proceedings. 45th Electronic Components and Technology Conference.