P. Gueguen

Recent developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking

J. Dechamp, L. Clavelier, F. Letertre, 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

(Invited) An Overview of Patterned Metal/Dielectric Surface Bonding: Mechanism, Alignment and Characterization

Laurent Clavelier, Didier Landru, Ionut Radu, 2010 .

Results on aligned SiO2/SiO2 direct wafer-to-wafer low temperature bonding for 3D integration

L. Di Cioccio, P. Gueguen, A. Garnier, 2009, 2009 IEEE International SOI Conference.