G. Subbarayan
发表
K. Mysore,
G. Subbarayan,
2009,
2009 IEEE International Electron Devices Meeting (IEDM).
S. Krishnan,
G. Subbarayan,
C-S. Lee,
2020,
2020 IEEE International Reliability Physics Symposium (IRPS).
V. Gupta,
G. Subbarayan,
D. Chan,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
G. Subbarayan,
B. Sammakia,
G. Subbarayan,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Sammakia,
G. Subbarayan,
T. Siegmund,
2008,
IEEE Transactions on Components and Packaging Technologies.
B. Sammakia,
Hung-Yun Lin,
G. Subbarayan,
2012,
IEEE Transactions on Device and Materials Reliability.
G. Subbarayan,
G. Subbarayan,
L. Nguyen,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
G. Subbarayan,
J. P. Tucker,
C. Handwerker,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
B. Sammakia,
A. Gowda,
G. Subbarayan,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
V. Gupta,
G. Subbarayan,
D. Bhate,
2008,
IEEE Transactions on Components and Packaging Technologies.
G. Subbarayan,
J. P. Tucker,
C. Handwerker,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
G. Subbarayan,
Xu Nie,
D. Bhate,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Gupta,
Ron Zhang,
G. Subbarayan,
2009,
IEEE Transactions on Electronics Packaging Manufacturing.