Jui-Chin Chen

Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer

John H. Lau, Chien-Chou Chen, Ming-Jer Kao, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Technologies and challenges of fine-pitch backside via-last 3DIC TSV process integration and its electrical characteristics and system applications

Ding-Ming Kwai, Chien-Chou Chen, Ming-Jer Kao, 2014, Proceedings of Technical Program - 2014 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA).

Effects of Slurry in Cu Chemical Mechanical Polishing (CMP) of TSVs for 3-D IC Integration

J. H. Lau, Ming-Jer Kao, Tzu-Kun Ku, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Key enabling technologies of 300mm 3DIC process integration

Chien-Chou Chen, Ming-Jer Kao, Tzu-Kun Ku, 2012, Proceedings of Technical Program of 2012 VLSI Technology, System and Application.

Low-cost 3DIC process technologies for wide-I/O memory cube

Chien-Chou Chen, Tzu-Kun Ku, Shang-Chun Chen, 2015, 2015 International Symposium on VLSI Technology, Systems and Applications.