G. Matijasevic

Thermal management with additive multilayer circuitry on metal substrates

G. Matijasevic, Pradeep Gandhi, C. Gallagher, 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

High-density interconnect substrates and device packaging using conductive composites

G. Matijasevic, Pradeep Gandhi, C. Gallagher, 1998, Other Conferences.

Thermal study of additive multilayer circuitry on polymer and metal substrates

Chin C. Lee, G. Matijasevic, Pradeep Gandhi, 1998, Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195).

High-sensitivity, surface-attached heat flux sensors

A. Barnes, G. Matijasevic, L. W. Langley, 1999 .

High density multilayer substrates using patterned microvia interposers

G. Matijasevic, Pradeep Gandhi, C. Gallagher, 1998, 1998 IEEE Aerospace Conference Proceedings (Cat. No.98TH8339).

A new bonding technology using gold and tin multilayer composite structures

G. Matijasevic, Chin C. Lee, G. Matijasevic, 1991 .

Extremely reliable bonding of large silicon dice using gold-tin alloy

G. Matijasevic, C.C. Lee, Chin C. Lee, 1990, 40th Conference Proceedings on Electronic Components and Technology.

Thermal Stress Considerations in Die-Attachment

G. Matijasevic, Chin C. Lee, C. Y. Wang, 1993 .

Void free bonding of large silicon dice using gold-tin alloys

G. Matijasevic, Chin C. Lee, C. Y. Wang, 1990 .

A fully additive, polymeric process for the fabrication and assembly of substrate and component level packaging

G. Matijasevic, Pradeep Gandhi, C. Gallagher, 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).

Metal-containing polymer-based composites for resistor and thermistor applications

G. Matijasevic, Pradeep Gandhi, Lutz Brandt, 1998 .

Highly reliable die attachment on polished GaAs surfaces using gold-tin eutectic alloy

G. Matijasevic, Chin C. Lee, 1989 .