Reinhard Pufall

发表

New aspects in characterization of adhesion of moulding compounds on different surfaces by using a simple button-shear-test method for lifetime prediction of power devices

Michael Goroll, Reinhard Pufall, R. Pufall, 2010, Microelectron. Reliab..

Exceptional operative gate voltage induces negative bias temperature instability (NBTI) on n-type trench DMOS transistors

Michael Goroll, Reinhard Pufall, Stefano Aresu, 2007, Microelectron. Reliab..

Non-destructive die attach test method for future robust packages - a proposal

Michael Goroll, Reinhard Pufall, Bernhard Wunderle, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

Semiconductors in high temperature applications - a future trend in automotive industry

Michael Goroll, Reinhard Pufall, Werner Kanert, 2004, Microelectron. Reliab..

Acoustic detection of micro-cracks in small electronic devices

Michael Goroll, Reinhard Pufall, Georg Michael Reuther, 2014, Microelectron. Reliab..

NBTI on smart power technologies: A detailed analysis of two concurrent effects using a re-examined on-the-fly technique

Michael Goroll, Reinhard Pufall, Wolfgang Gustin, 2008, Microelectron. Reliab..

Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests

Michael Goroll, Reinhard Pufall, Rainer Dudek, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

New aspects for lifetime prediction of bipolar transistors in automotive power wafer technologies by using a power law fitting procedure

Michael Goroll, Reinhard Pufall, Wolfgang Gustin, 2008, Microelectron. Reliab..

Analysis of ESD protection structure behaviour after ageing as new approach for system level reliability of automotive power devices

Michael Goroll, Reinhard Pufall, Stefano Aresu, 2007, Microelectron. Reliab..

Reduction of test effort. Looking for more acceleration for reliable components for automotive applications

Michael Goroll, Reinhard Pufall, Stefano Aresu, 2008, Microelectron. Reliab..

ESD protection structure qualification - a new approach for release for automotive applications

Michael Goroll, Reinhard Pufall, Werner Kanert, 2006, Microelectron. Reliab..

The European 3D Heterogeneous Integration Platform (e-BRAINS) - a Particular Focus on Reliability and Low-Temperature Processes for 3D Integrated Sensor Systems

Alan Mathewson, Peter Ramm, Armin Klumpp, 2015 .

Benchmark of Battery Storage Topologies in Cost, Efficiency and Safety

Andreas Jossen, Reinhard Pufall, Dirk Uwe Sauer, 2017 .

Investigation of chip-package interaction-looking for more acceleration in product qualification tests

Reinhard Pufall, Werner Kanert, 2009, 2009 IEEE International Reliability Physics Symposium.

Determination of adhesion and delamination prediction for semiconductor packages by using Grey Scale Correlation and Cohesive Zone Modelling

Michael Goroll, Reinhard Pufall, R. Pufall, 2012, Microelectron. Reliab..

Studies on the reliability of power packages based on strength and fracture criteria

Bernd Michel, Reinhard Pufall, Rainer Dudek, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Studies on the reliability of power packages based on strength and fracture criteria

Bernd Michel, Reinhard Pufall, Rainer Dudek, 2011, EuroSimE 2011.

Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests

Michael Goroll, Reinhard Pufall, Rainer Dudek, 2011, EuroSimE 2011.

Experimental determination of critical adhesion energies with the Advanced Button Shear Test

Michael Goroll, Reinhard Pufall, Bernhard Wunderle, 2019, Microelectronics Reliability.