Mitsuyasu Matsuo

A Method of Thermal Displacement Compensation for Machining Center by Temperatures Measured on the Machine. 2nd Report. Automatic Compensation Using an NC Controller Marketed.

Takeshi Yasui, Toyoshiro Inamura, Mitsuyasu Matsuo, 1991 .

Chip scale package (CSP) "a lightly dressed LSI chip"

T. Tachikawa, Shinji Baba, Mitsuyasu Matsuo, 1994, Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium.

High-speed test of thermal effects for a machine-tool structure based on modal analysis

Mitsuyasu Matsuo, T. Yasui, T. Inamura, 1986 .

Chip scale package: "a lightly dressed LSI chip"

T. Tachikawa, Shinji Baba, Hironori Matsushima, 1995 .

A method of thermal displacement compensation for machining center by temperatures measured on the machine. (1st report). Determination of a mathematical model between the cutting point thermal displacement and temperatures.

Toyoshiro Inamura, Takeshi Yasui, Mitsuyasu Matsuo, 1991 .