Takashi Kawanoue

Investigation of Cu ion drift through CVD TiSiN into SiO2 under bias temperature stress conditions

Takashi Yoda, Takashi Kawanoue, Seiichi Omoto, 2005, IEICE Electron. Express.

A newly developed model for stress induced slit-like voiding

Hisashi Kaneko, M. Miyauchi, Takashi Kawanoue, 1990, 28th Annual Proceedings on Reliability Physics Symposium.

Double-Level Cu Inlaid Interconnects with Simultaneously Filled Via-Plugs

Hideaki Hirabayashi, Tadashi Iijima, Toshio Shimizu, 1995 .

Single crystal aluminum lines with excellent endurance against stress induced failure

Hisashi Kaneko, M. Miyauchi, Takashi Kawanoue, 1989, International Technical Digest on Electron Devices Meeting.