K. N. Chen

Improvement of Motional Resistance through Concave TSV Design and Modification for Static Capacitance of TSV-Based Resonator

J. Y. Shih, Y. C. Chen, C. H. Chiu, 2014 .

Interfacial morphologies and possible mechanisms of copper wafer bonding

K. N. Chen, A. Fan, R. Reif, 2002 .

Investigations of adhesion between Cu and Benzocyclobutene (BCB) polymer dielectric for 3D integration applications

K. N. Chen, W. C. Huang, C. T. Ko, 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Electrical characterization and reliability investigations of Cu TSVs with wafer-level Cu/Sn-BCB hybrid bonding

W. C. Lo, Y. H. Chen, K. N. Chen, 2012, Proceedings of Technical Program of 2012 VLSI Technology, System and Application.

Reliability and structural design of a wafer-level 3D integration scheme with W TSVs based on Cu-oxide hybrid wafer bonding

T. M. Shaw, K. N. Chen, C. Cabral, 2010, 2010 International Electron Devices Meeting.

Investigation of bonding temperature for SU-8 materials in wafer-level hybrid bonding technology for 3D IC

K. N. Chen, C. Ko, C. A. Cheng, 2011, The 4th IEEE International NanoElectronics Conference.

Studies of oxide to polymer bonding for 3D IC

K. N. Chen, W. C. Huang, S. -. Lin, 2011, The 4th IEEE International NanoElectronics Conference.

Structural design, process, and reliability of a wafer-level 3D integration scheme with Cu TSVs based on micro-bump/adhesive hybrid wafer bonding

C. K. Lee, Y. J. Huang, Y. H. Chen, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.