Patrick Schiavone

发表

Simulation of extreme ultraviolet masks with defective multilayers

Andreas Erdmann, Peter Evanschitzky, M. Besacier, 2003, Photomask Japan.

Comparison of various lithography strategies for the 65- and 45-nm half pitch using simulation

Patrick Schiavone, David Fuard, 2004, SPIE Advanced Lithography.

Outliers detection by fuzzy classification method for model building

Patrick Schiavone, David Fuard, Vincent Farys, 2009, Advanced Lithography.

OPC model error study through mask and SEM measurement error

Patrick Schiavone, David Fuard, Vincent Farys, 2010, Advanced Lithography.

Phase aware proximity correction for advanced masks

Franklin M. Schellenberg, Yuri Granik, Patrick Schiavone, 2000, Advanced Lithography.

Clear-field alternating PSM for 193-nm lithography

Patrick Schiavone, Alain Prola, Frederic P. Lalanne, 1999, Advanced Lithography.

Reticle level compensation for long range effects

Patrick Schiavone, Thiago Figueiro, Clyde Browning, 2013, Advanced Lithography.

Application of a new approach to optical proximity correction

Wolfram Ziegler, Patrick Schiavone, Olivier Toublan, 1999, Advanced Lithography.

Prediction of lithographic performance of resist/BARC bilayers in topographic situations: application to organic and inorganic BARCs

Patrick Schiavone, Andre Schiltz, 1997, Advanced Lithography.

Understanding of the depth of focus evolution from an analysis of the iso-focal point

Patrick Schiavone, Serdar Manakli, Y. Trouiller, 2004, SPIE Advanced Lithography.

An inverse ellipsometric problem for thin film characterization: comparison of different optimization methods

Jérôme Hazart, Patrick Schiavone, David Fuard, 2009, Advanced Lithography.

Three-dimensional rigorous simulation of EUV defective masks using modal method by Fourier expansion

M. Besacier, Patrick Schiavone, Rafik Smaali, 2006, SPIE Advanced Lithography.

In vivo measurement of human brain elasticity using a light aspiration device

Yohan Payan, Thomas Boudou, Patrick Schiavone, 2009, Medical Image Anal..

Complementary double-exposure technique (CODE): a way to print 80-nm gate level using a double-exposure binary mask approach

Jean-Damien Chapon, Patrick Schiavone, Frank Sundermann, 2002, SPIE Advanced Lithography.

OPC for curved designs in application to photonics on silicon

Sergei V. Postnikov, Patrick Schiavone, Vincent Farys, 2016, Advanced Lithography.

Curvilinear data processing methods and verification

Patrick Schiavone, Clyde Browning, Sébastien Bayle, 2018, European Mask and Lithography Conference.

Demonstration of an effective mask proximity correction for advanced photomask

Sergei V. Postnikov, Patrick Schiavone, Luc Martin, 2018, Photomask Japan.

Process optimization of a negative-tone CVD photoresist for 193-nm lithography applications

Cedric Monget, Olivier Joubert, Timothy W. Weidman, 1999, Advanced Lithography.

Inorganic bottom ARC SiOxNy for interconnection levels on 0.18-μm technology

Patrick Schiavone, Yorick Trouiller, Yves Quere, 1998, Advanced Lithography.

Sensitivity analysis for accurate determination of PSF parameters

Patrick Schiavone, Thiago Figueiro, Jean-Hervé Tortai, 2012 .

Advanced module for model parameter extraction using global optimization and sensitivity analysis for electron beam proximity effect correction

Christoph Hohle, Manuela Gutsch, Patrick Schiavone, 2012, Photomask Technology.

Using the CODE technique to print complex two-dimensional structures in a 90-nm ground rule process

Patrick Schiavone, Olivier Toublan, Yves Rody, 2003, SPIE Advanced Lithography.

Flare impact on the intrafield CD control for sub-0.25-μm patterning

Patrick Schiavone, Olivier Toublan, André Weill, 1999, Advanced Lithography.

LASTIC: A Light Aspiration Device for in vivo Soft TIssue Characterization

Yohan Payan, Patrick Schiavone, Emmanuel Promayon, 2010, ISMBS.

Combined dose and geometry correction (DMG) for low energy multi electron beam lithography (5kV): application to the 16nm node

Jérôme Belledent, Patrick Schiavone, Luc Martin, 2012, Advanced Lithography.

Critical failure ORC: Improving model accuracy through enhanced model generation

Jerome Belledent, Stanislas Baron, Kevin Lucas, 2006 .

Contour based metrology: “make measurable what is not so"

Patrick Schiavone, Julien Ducoté, Charlotte Beylier, 2020, Advanced Lithography.

Improved electron backscattering representation using a new class of distribution: application to EUV masks

Patrick Schiavone, Thiago Figueiro, Mohamed Saib, 2012, Advanced Lithography.

Sensitivity analysis for high accuracy proximity effect correction

Christoph Hohle, Patrick Schiavone, Johann W. Bartha, 2015, SPIE Photomask Technology.

Photonic curvilinear data processing

Aurélien Fay, Jerome Belledent, Patrick Schiavone, 2014, Photomask Technology.

Efficient large volume data preparation for electron beam lithography for sub-45nm node

Christoph Hohle, Manuela Gutsch, Patrick Schiavone, 2011, Photomask Technology.

Application of alternating-type phase shift mask to polysilicon level for random logic circuits

Patrick Schiavone, Frederic Lalanne, Gérald Galan, 1994 .

Reducing or eliminating line-end shortening and iso/dense bias by tuning NA and sigma

Patrick Schiavone, Olivier Toublan, 1998, Advanced Lithography.

Assessment of the critical dimension prediction accuracy for the lumped parameter model for resist lithography

Patrick Schiavone, David Fuard, 2004 .

The Rayleigh method applied to EUV lithography simulation

Patrick Schiavone, Vincent Farys, Maxime Besacier, 2003, SPIE Advanced Lithography.

A novel mask proximity correction software combining accuracy and reduced writing time for the manufacturing of advanced photomasks

Tadahiko Takikawa, Naoya Hayashi, Shogo Narukawa, 2012, Other Conferences.

Process window OPC verification: dry versus immersion lithography for the 65nm node

Jerome Belledent, Kevin Lucas, Christophe Couderc, 2006, SPIE Advanced Lithography.

Assessment of different simplified resist models

Patrick Schiavone, David Fuard, M. Besacier, 2002, SPIE Advanced Lithography.

FEM simulation of charging effect during SEM metrology

Patrick Schiavone, Jean-Hervé Tortai, Duy Duc Nguyen, 2018, European Mask and Lithography Conference.

Through-process window resist modelling strategies for the 65 nm node

Jerome Belledent, Stanislas Baron, Kevin Lucas, 2005, SPIE Photomask Technology.

Complementary double-exposure technique (CODE): a way to print 80- and 65-nm gate levels using a double-exposure binary mask approach

Patrick Schiavone, Olivier Toublan, Yves Rody, 2004 .

0.2-um lithography using i-line and alternating phase-shift mask

Patrick Schiavone, Frederic P. Lalanne, 1996, Advanced Lithography.

Metrology variability and its impact in process modeling

Christoph Hohle, Patrick Schiavone, Thiago Figueiro, 2013, Photomask Technology.

New approach to optical proximity correction

Wolfram Ziegler, Patrick Schiavone, Olivier Toublan, 1998, Photomask Technology.

Dynamic scatterometry tool development for real time profile shape reconstruction

M. Besacier, Patrick Schiavone, Sébastien Soulan, 2009 .

Extreme long range process effects characterization and compensation

Christoph Hohle, Patrick Schiavone, Thiago Figueiro, 2013, Other Conferences.

Mask process matching using a model based data preparation solution

Chris Progler, Patrick Schiavone, Brian Dillon, 2015, SPIE Photomask Technology.

Validity of the diffused aerial image model: an assessment based on multiple test cases

Patrick Schiavone, David Fuard, M. Besacier, 2003, SPIE Advanced Lithography.

Real-time profile shape reconstruction using dynamic scatterometry

M. Besacier, Patrick Schiavone, Tanguy Leveder, 2007, SPIE Advanced Lithography.

In-line etching process control using dynamic scatterometry

M. Besacier, Patrick Schiavone, Tanguy Leveder, 2007, SPIE Optical Metrology.

0.12 mm Optical Lithography Performances Using an Alternating DUV Phase Shift Mask

Patrick Schiavone, Yves Quere, Thierry Mourier, 1998 .

Shot count reduction for non-Manhattan geometries: concurrent optimization of data fracture and mask writer design

Patrick Schiavone, Tadashi Komagata, Luc Martin, 2013, Photomask Technology.

Proposal of a new data format for multibeam mask writer with curve expression

Noriaki Nakayamada, Patrick Schiavone, Thiago Figueiro, 2019 .

Verification: an enabler for model based data preparation

Patrick Schiavone, Luc Martin, Vincent Annezo, 2013, Photomask and Next Generation Lithography Mask Technology.

Effective corner rounding correction in the data preparation for electron beam lithography

Christoph Hohle, Patrick Schiavone, Thiago Figueiro, 2014, Photomask Technology.

In vivo measurement of the human soft tissues constitutive laws. Applications to computer aided surgery

Y. Payan, Patrick Schiavone, J. Ohayon, 2007 .

Improvement of Electron Beam Lithography modeling for overdose exposures by using Dill transformation

Patrick Schiavone, Jean-Hervé Tortai, Mohamed Saib, 2016, Photomask Technology.

Feature shape variation using scatterometry

Patrick Schiavone, Vincent Farys, André Michallet, 2002, SPIE Advanced Lithography.

Shadowing effect minimization in EUV mask by modeling

M. Besacier, Patrick Schiavone, 2004, Photomask Japan.

Data preparation in the age of curvilinear patterns

Sergei Postnikov, Patrick Schiavone, Thiago Figueiro, 2017, Photomask Japan.

0.18-μm optical lithography performances using an alternating DUV phase-shift mask

Patrick Schiavone, Yorick Trouiller, Yves Quere, 1998, Advanced Lithography.

Complementary Double Exposure Technique (CODE) solutions to the two-dimensional structures of the 90nm node

Patrick Schiavone, Olivier Toublan, Yorick Trouiller, 2002, Photomask Technology.

Contour based metrology: getting more from a SEM image

Patrick Schiavone, B. Le Gratiet, Christophe Dezauzier, 2019, Advanced Lithography.

Analysis of the diffraction pattern for optimal assist feature placement

Jonathan Planchot, Jerome Belledent, Christophe Couderc, 2007 .

PSF calibration patterns selection based on sensitivity analysis

Patrick Schiavone, Thiago Figueiro, Jean-Hervé Tortai, 2013 .

Method for correction of electronic proximity effects using type of broadcast functions voigt

Patrick Schiavone, Thiago Figueiro, Jean-Hervé Tortai, 2012 .

High accuracy 65nm OPC verification: full process window model vs. critical failure ORC

Jerome Belledent, Stanislas Baron, Kevin Lucas, 2004, SPIE Advanced Lithography.

Analysis of feature shape variation using scatterometry

Patrick Schiavone, Vincent Farys, André Michallet, 2002 .

Determining the validity domain of roughness measurements as a function of CD-SEM acquisition conditions

Patrick Schiavone, Jean-Baptiste Henry, Estelle Guyez, 2021, Advanced Lithography.

Roughness measurement of 2D curvilinear patterns: challenges and advanced methodology

Aurélie Le Pennec, Patrick Schiavone, Jean-Baptiste Henry, 2021, Advanced Lithography.

Investigating SEM-contour to CD-SEM matching

Patrick Schiavone, Francois Weisbuch, Thiago Figueiro, 2021, Advanced Lithography.

Contour metrology accuracy assessment using TMU analysis

Patrick Schiavone, Matthew Sendelbach, Thiago Figueiro, 2021 .

Pattern placement and shape distortion control using contour-based metrology

Patrick Schiavone, Alain Ostrovsky, Christian Gardin, 2021, Advanced Lithography.

Concept of two-dimensional swing curves for critical dimension prediction and optimization of resist/antireflective coating bilayers in topographic situations

Patrick Schiavone, Andre´ Schiltz, 2000 .

Rigorous electromagnetic simulation of EUV masks: influence of the absorber properties

Patrick Schiavone, Jean-Yves Robic, Gérard Granet, 2001 .

Mold deformation in nanoimprint lithography

Patrick Schiavone, C. Perret, Cécile Gourgon, 2004 .

Optimisation of EUV mask absorbing layers

Patrick Schiavone, Jean Yves Robic, Vincent Rodillon, 2002 .

Combination multiple focal planes and PSM for sub 120 nm node with KrF lithography: study of the proximity effects

Patrick Schiavone, Yves Rody, Yorick Trouiller, 2002 .

Measurement of residual thickness using scatterometry

Patrick Schiavone, David Fuard, Vincent Farys, 2005 .

Real time scatterometry for profile control during resist trimming process

M. Besacier, Patrick Schiavone, Sébastien Soulan, 2009 .