Dominik Truessel

A new HiPak Module Platform with Improved Reliability

Sven Matthias, H. Beyer, Fabian Fischer, 2014 .

The 62Pak IGBT modules employing 1700V SPT++ chip set for 175°C operation

Munaf Rahimo, Arnost Kopta, R. Schnell, 2016 .

LinPak, a new low inductive phase-leg IGBT module with easy paralleling for high power density converter designs

Munaf Rahimo, R. Schnell, Samuel Hartmann, 2015 .

Packaging Technology Platform for Next Generation High Power IGBT Modules

Samuel Hartmann, Charalampos Papadopoulos, Dominik Truessel, 2014 .