King L. Tai

Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology

Yee L. Low, Wayne Wei-Ming Dai, Michael X. Wang, 2000, Proceedings 2000. Design Automation Conference. (IEEE Cat. No.00CH37106).

System-In-Package (SIP): challenges and opportunities

King L. Tai, 2000, Proceedings 2000. Design Automation Conference. (IEEE Cat. No.00CH37106).

Trends in silicon-on-silicon multichip modules

Robert C. Frye, Maureen Y. Lau, King L. Tai, 1993, IEEE Design & Test of Computers.

System-in-package (SIP): challenges and opportunities

King L. Tai, 2000, ASP-DAC '00.

Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology

Michael X. Wang, Katsuharu Suzuki, King L. Tai, 2000, ASP-DAC '00.