Wolfgang Appel

CAN-Based Electronics in the Mercedes-Benz Actros

Wolfgang Appel, 1997 .

Ultra-thin chip technology and applications, a new paradigm in silicon technology

Martin Zimmermann, Joachim N. Burghartz, Christine Harendt, 2010 .

Manufacturing aspects of an ultra-thin chip technology

Joachim N. Burghartz, Christine Harendt, Martin Zimmermann, 2012, 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC).

Ultra-thin chips and related applications, a new paradigm in silicon technology

Joachim N. Burghartz, Christine Harendt, Horst Rempp, 2009, 2009 Proceedings of the European Solid State Device Research Conference.

5.1 Front-Office-Prozesse

Wolfgang Appel, 2015 .

Ultra-thin chip technology for system-in-foil applications

Joachim N. Burghartz, Christine Harendt, Saleh Ferwana, 2010, 2010 International Electron Devices Meeting.

Fabrication of Ultra-thin Chips Using Silicon Wafers with Buried Cavities

Joachim N. Burghartz, Christine Harendt, Wolfgang Appel, 2011 .