Luhua Xu

SiPh Self-Coherent Transmitter Circuit with on-Chip CSPR Control Capability Based on a Tunable Power Splitter

Zhenping Xing, David V. Plant, Meng Xiang, 2019, 2019 Optical Fiber Communications Conference and Exhibition (OFC).

Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins

Jianmin Miao, John H. L. Pang, Robert Preisser, 2007 .

Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish

W.H. Zhu, C.K. Wang, A.Y.S. Sun, 2008, 2008 58th Electronic Components and Technology Conference.

Electromigration induced ductile-to-brittle transition in lead-free solder joints

John H. L. Pang, Jae-Woong Nah, King-Ning Tu, 2006 .

Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint

Luhua Xu, J. Pang, Luhua Xu, 2006, 56th Electronic Components and Technology Conference 2006.

Drop reliability performance assessment for PCB assemblies of chip scale packages (CSP)

D.Y.R. Chong, B.K. Lim, Luhua Xu, 2005, 2005 7th Electronic Packaging Technology Conference.

Intermetallic growth studies on SAC/ENIG and SAC/Cu-OSP lead-free solder joints

Luhua Xu, J. Pang, Luhua Xu, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Combined thermal and electromigration exposure effect on SnAgCu BGA solder joint reliability

Luhua Xu, J. Pang, Luhua Xu, 2006, 56th Electronic Components and Technology Conference 2006.