M. Hodes
发表
V. Bahadur,
S.V. Garimella,
S. Krishnan,
2008,
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
R. Wilcoxon,
M. Hodes,
M. Hodes,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
M. Hodes,
M. Hodes,
Elizabeth Brownell,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Hodes,
2004,
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
M. Hodes,
M. Hodes,
2007,
IEEE Transactions on Components and Packaging Technologies.
R. Wilcoxon,
M. Hodes,
Rui Zhang,
2013,
29th IEEE Semiconductor Thermal Measurement and Management Symposium.
S. Krishnan,
M. Hodes,
D. Hernon,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Hodes,
S. Garimella,
T. Salamon,
2010,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. Hodes,
V. P. Manno,
M. Cleary,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.